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MINNETONKA, Minn., August 14, 2017 – Digi International®, (NASDAQ: DGII, www.digi.com), a leading global provider of machine-to-machine (M2M) and Internet of Things (IoT) connectivity products and services, today announced the immediate availability of the Digi XBee® SX 868, a surface mount (SMT) radio communication module with industry-leading interference blocking for noisy wireless environments. Deployable in several regions throughout the world and with pre-certification for EU countries, the module offers extremely reliable long-range, low-data rate connectivity for industrial IoT applications such as agriculture, heavy equipment, transportation, and energy/utilities.

The compact SMT module, measuring about 22 x 34 mm, operates in the 863 - 870 MHz frequency band (K, L, M, N, Q/R) and combines tuned Surface Acoustic Wave (SAW) filtering as well as intelligent Listen Before Talk / Adaptive Frequency Agility (LBT/AFA) technology to avoid connectivity issues caused by external radio interference. The patented frequency scan occurs automatically without performance impact by listening to the radio environment before any transmission starts, automatically shifting to a new channel when a interference source is detected.[Continue reading →]

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SAN JOSE, Calif. -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it has collaborated with the Embedded Real-Time System Laboratory of Nagoya University to port the AUTOSAR-compliant TOPPERS ATK2-SC1 (Toyohashi OPen Platform for Embedded Real-time Systems Automotive Kernel version-2 Scalability Class 1) to Cadence® Tensilica® processors and DSPs. Nagoya University and Cadence jointly ported the ATK2-SC1 to the Tensilica processor platform, validating that it functions correctly and operates at competitive performance levels. With this port, developers working on advanced driver assistance system (ADAS), human machine interface (HMI), autonomous driving system and other automotive applications requiring the high computational capabilities of Tensilica processors can start early development of automotive applications on the TOPPERS automotive kernel. For more information about ATK2-SC1, visit https://www.toppers.jp/atk2.html.

Automotive electronic systems are increasing exponentially in complexity, making it increasingly challenging for electronic control units (ECUs) to perform their specific control functions while also connecting to the various automotive networks reliably. The AUTOSAR architecture organizes the building blocks that compose the ECU software stack, allowing multiple suppliers and OEMs to collaborate on the development of critical system components. Reuse of well-defined software components allows ECUs to be developed quickly and efficiently, and systems are becoming more heterogeneous in their deployment of processors and DSPs.[Continue reading →]

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