Signal Processing COTS Standards

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Spectrum\'s SCAPP Currently digitizers have a bottleneck caused by having to use either the host PC's central processor with 8 or 16 cores or a FPGA that is complex to program. Spectrum Instrumentation has solved this problem with its new SCAPP software option - the Spectrum CUDA Access for Parallel Processing - that opens an easy-to-use yet extremely powerful way to digitize, process and analyze electronic signals. SCAPP allows a CUDA-based Graphical Processing Unit (GPU) to be used directly between any Spectrum digitizer and the PC. The big advantage is that data is passed directly from the digitizer to the GPU where high-speed parallel processing is possible using the GPU board's multiple (up to 5000) processing cores. That provides a significant performance enhancement when compared to sending data directly to a PC that may have only 8 or 16 cores. It becomes even more important when signals are being digitized at high-speeds such as 50 MS/s, 500 MS/s or even 5 GS/s.

Spectrum's SCAPP [Continue reading →]

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ANDOVER, Mass. - Nov. 16, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced the Ensemble® 6000 Series GSC6202 6U OpenVPX™ general purpose graphics processor unit (GPGPU) module with two NVIDIA® Pascal™ or Maxwell™ architecture GPU processors. The module’s immense parallel computing capability is ideal for image processing, artificial intelligence, and computational neural networks in electro-optic/infrared (EO/IR), radar signal processing, and electronic warfare (EW) applications.

The GSC6202 GPGPU module features two NVIDIA Pascal or Maxwell-class GPUs with up to a total of 4096 CUDA® cores and 32 GB memory. The GPUs are connected to a PCI Express Gen 3.0 switch network with dual x16 connections to the backplane. This balanced architecture provides the processing power, memory, and I/O for the most challenging image processing, radar processing, or cognitive and adaptive algorithms for agile threat assessment and response. Mercury’s advanced cooling technology standards such as Air Flow-By™ cooling and Liquid Flow-Through cooling enable the use of the fastest GPU chips and PCI Express switches running at full speed even in rugged environments.[Continue reading →]

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ANDOVER, Mass. - Nov. 16, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced the Ensemble® 6000 Series GSC6202 6U OpenVPX™ general purpose graphics processor unit (GPGPU) module with two NVIDIA® Pascal™ or Maxwell™ architecture GPU processors. The module’s immense parallel computing capability is ideal for image processing, artificial intelligence, and computational neural networks in electro-optic/infrared (EO/IR), radar signal processing, and electronic warfare (EW) applications.

The GSC6202 GPGPU module features two NVIDIA Pascal or Maxwell-class GPUs with up to a total of 4096 CUDA® cores and 32 GB memory. The GPUs are connected to a PCI Express Gen 3.0 switch network with dual x16 connections to the backplane. This balanced architecture provides the processing power, memory, and I/O for the most challenging image processing, radar processing, or cognitive and adaptive algorithms for agile threat assessment and response. Mercury’s advanced cooling technology standards such as Air Flow-By™ cooling and Liquid Flow-Through cooling enable the use of the fastest GPU chips and PCI Express switches running at full speed even in rugged environments.[Continue reading →]

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Diamond Systems Corporation unveils its ultra-small COM-based ZETA single board computer family. The Zeta family include interchangeable COM Express COMs for scalability and long product life, ultra-compact size, and an unsurpassed level of I/O, including a complete high-quality analog and digital data acquisition subsystem.[Continue reading →]

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Radar, communications, and SIGINT [signals intelligence] systems have traditionally combined sensor processing, data conversion, and signal processing hardware within single enclosures or equipment racks. Analog signals for antennas, transducers and other sensors were connected through cables, often causing loss and interference along the way. However, enabled by new data converter and field-programmable gate array (FPGA) technology and evolving open embedded computing standards, system designers can now deploy small-form-factor (SFF) subsystems at each sensor site for distributed signal acquisition and preprocessing. Digitized signals are then delivered through optical cables, providing higher signal quality over longer connection distances while reducing size, weight, cost, and maintenance.[Continue reading →]

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PICMG standards such as CompactPCI have been leveraged for years in aerospace and defense applications such as communications, avionics, and satellites. Today, the fastest growing standard from the PICMG experts is COM Express, thanks to its flexibility and reduced size, weight, and power (SWaP) characteristics.[Continue reading →]

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What continues to make PICMG successful as a standards body is our community of members and your collaboration in pursuit of innovation. As officers of PICMG, our mission is to shepherd and encourage that collaboration, making sure that the process moves along and that member voices are heard. The standard development process within PICMG is flexible - members can prepare pre-work of a potential standard before coming to PICMG (CompactPCI was introduced this way) or develop them within open committees under the aegis of PICMG. It's all about collaboration. The value of open standards adoption is that it helps the industry by enabling interoperability, multivendor solutions, flexibility, and reduced time to market for end users.[Continue reading →]

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RFA 600 Typical applications for this device are pulsed laser devices, radar systems, ultra sonic systems, automated test environment (ATE), VHF transmitters, data cable drivers, HDTV cable drivers, signal generator output stages and many more.

What makes the product outstanding for this category is the output voltage swing, that can be as high as 22 V. This is possible due to the discrete circuit design and sophisticated components. Unlike most RF amplifiers, it processes True-DC signals. This is very important for accurate pulse amplification and analysis, especially when the pulses have different length.[Continue reading →]

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2017-10-09 Mercury Systems Launches 6U OpenVPX Server with Extreme Durability_LDS6527 ANDOVER, Mass. - Oct. 9, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced the Ensemble® 6000 Series LDS6527 6U OpenVPX™ single board computer (SBC) with available options for Modified Off-the-Shelf (MOTS) extreme durability configurations and BuiltSECURE™ technology. MOTS configurations leverage enhanced commercial components, board fabrication rules, and subsystem design techniques to withstand extreme temperature cycles over a longer period of time than standard rugged designs. For deployment at the tactical edge and export to U.S. allies, Mercury’s BuiltSECURE technology counters nation-state reverse engineering through world-class systems security engineering expertise.

Featuring an embedded-server-class 12-core Intel® Xeon® Processor D family CPU, two mezzanine sites for agile I/O customization, and 40/10 Gbit Ethernet or InfiniBand™ FDR10 switched communications for a high bandwidth data plane, the LDS6527 seamlessly supports open data movement middleware alongside APIs to ensure customers’ software investment is preserved. Mercury’s advanced cooling technology standards such as Air Flow-By™ cooling enable the use of the hotter server CPU and InfiniBand chips. In addition to traditional signal processing for radar and electro-optic/infrared (EO/IR), the LDS6527 SBC has capabilities to provide on-board data exploitation for the most demanding ISR applications as well as cognitive or adaptive algorithms for agile communications, EW, and radar systems.[Continue reading →]

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RANCHO CUCAMONGA, Calif., October 9, 2017 – General Micro Systems Inc. (GMS) today announced that the U.S. Army will exclusively deploy powerful rugged server and display systems from GMS to run the multifunction video display (MVD) software within Type II medium mine protection vehicles (MMPV). The prime contract—composed of four electronic components and estimated at $88 million over three years—provides the Army a dense, ultra-small, rugged server using the same high-performing Intel® Xeon® E5 processors that Apple® is shipping in its latest “Pro” products.

“For the first time, the U.S. Army will have deployed military technology that is as leading-edge as the latest and best-available commercial technology in the consumer market,” said Ben Sharfi, CEO and chief architect, GMS.[Continue reading →]

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Rugged processor with 10Gigabit Ethernet Concurrent Technologies latest product combines high performance processing with multiple 10 Gigabit connections for deployment in computer applications requiring higher bandwidth local area network connectivity.

The single slot BA 1TR/501 features a 4-core Intel® Xeon® processor E3-1505M v5 with 16GB of DDR4 ECC DRAM and a rich assortment of I/O interfaces including dual 10 Gigabit and dual Gigabit Ethernet connections. The product is designed to suit the growing number of high performance command, control, communicate and compute applications in the military and aerospace markets that need matching network and processor capacity. [Continue reading →]

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XM61001 July 24th, 2017, as an independent embedded computer manufacturer, LinkedHope® released a China local-designed, local-manufactured XMC processor board XM61001, which is a XMC graphics & image processing board mainly used for high-performance embedded graphics & image processing and GPU general-purpose computing (GPGPU) applications. Based on AMD Radeon™ E8860 embedded GPU, XM61001 provides 768/48 GFLOPS single/double precision peak (600e/4.5Gbps) processing performance, 640 independent computing units (shaders) as well as a maximum power consumption of 37W and a minimal power consumption of about 15W when adjusted to low power mode. It is especially suitable for high definition (1920*1080) and 4K (3840*2160) UHD displays, high-performance parallel computing and other GPGPU applications.

XM61001 has a 128-bit GDDR5 independent video memory up to 2GB, and the whole board is reinforced to meet the anti-shock and anti-vibration requirement described in VITA 42 and VITA 48 specifications. XM61001 also supports OpenGL 4.2, DirectX 11.1 APIs and industry-standard OpenCL™ 1.2 program language.[Continue reading →]

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RFEL HALO RPDS Newport, Isle of Wight, UK - 3 March 2017 - RFEL has supplied the Defence Science and Technology Laboratory (DSTL), UK with two HALO™ Rapid Prototype Development Systems (RPDS). These systems will be used by DSTL to evaluate RFEL's and 3rd party video processing algorithms for real-time video trials and to support interactive demonstrations to military users. This approach will dramatically speed up the assessment of complex video processing solutions, where traditional software simulation suffers from prohibitively long simulation times when assessing real-world performance.

Simulation has traditionally been used to mitigate the risk of deploying algorithms using expensive bespoke hardware. However, the flexibility and high performance of the HALO RPDS system using System-on-Chip (SoC) technology means that it is now possible to experiment with algorithms in hardware to accelerate testing, while automatically ensuring that any successful candidate solutions are inherently supported on the HALO platform.[Continue reading →]

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Recently, the U.S.-based Internet service provider OneWeb ordered 900 satellites to provide additional global broadband. Knowing that this volume is more than half of the total 1,400 satellites already in orbit, and knowing that the cost for sending one into space is about $100 million, the industry needs to start thinking about new technologies that could help manage the mass of satellites that must be produced every year.[Continue reading →]

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The xTCA for Physics PICMG standards work began in 2009 after several years of investigation into the suitability of ATCA as a controls platform for several new accelerators then under consideration.[Continue reading →]

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In the current environment of "open source everything," is there still a role for PICMG and open specifications? Doug Sandy, vice president of technology and CTO for PICMG, explores the past and future of PICMG within the emerging industry landscape.[Continue reading →]

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PICMG got its start back in 1994 with the development of the first edge card computing industry standard: PICMG 1.0. Since then edge card computing has evolved to incorporate the latest PCI Express interface methodology and implementation standards in the SHB Express or PICMG 1.3 industry standard.[Continue reading →]

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uCOM-AL6C Ubiqconn Technology, an innovative manufacturer specializing in Embedded IoT and Industrial 4.0 solutions, today introduced its COM Express Compact Type 6 module - uCOM-AL6C, empowered by the latest 14nm Intel® AtomTM E3900 series processors, formerly Apollo Lake-I. The adoption of the latest Intel® AtomTM CPUs offers enhanced processing power, real-time computing and lower power consumption on a compact 95x95mm2 COM Express module. uCOM-AL6C is designed to fit the demanding requirements in Embedded IoT, smart factory, smart edge gateway and other Industrial 4.0 related applications which design of power and space is critical.

Intel® AtomTM x5-E3930, x5-E3940, or x7-E3950 SoC processor offers frequency up to 2.0GHz and TDP as low as 6.5 Watt or above. The adoption of the new Intel® 14nm AtomTM SoC series also delivers IoT-oriented platform features including DDR3L-1,600 SO-DIMM up to 8GB, conflict-free Embedded Options Available, Intel® Gen9 Graphics 505/500 with 4K support and Intel® Quick Sync Video. These technological enhancements enable uCOM-AL6C to function as a core in Embedded IoT and Industrial 4.0 applications, such as production system gateway, automated factory monitoring, real-time sensor data processing, and factory control box.[Continue reading →]

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Leaders of PICMG say that their standards continue to grow in adoption across the globe, with COM Express making huge inroads in Asia and Internet of Things (IoT) markets while CompactPCI Serial grows in acceptance in Europe.[Continue reading →]

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Last year ended with the loss of Joe Pavlat, who successfully led this organization for over 20 years. He worked with members to establish PICMG as a global leader in open standards for embedded computing. We are grateful for his service and will continue to build and improve the organization he helped found.[Continue reading →]

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• Industrial Internet Control System from GE greatly improves operational equipment efficiency and enables quantum leaps in productivity • Unique solution combining connected machine controllers with cloud connectivity, advanced analytics software and apps for plant and asset control in real time[Continue reading →]

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PICMG is a nonprofit consortium of companies and organizations that collaboratively develop open standards for high-performance telecommunications, military, industrial, and general-purpose embedded computing applications.[Continue reading →]

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Summer ended with sad news for our OpenSystems Media family when we learned that our friend and coworker, Joe Pavlat, Editorial Director of PICMG Technologies magazine, passed away suddenly at his home in Grass Valley, California. He was only 63 years old.[Continue reading →]

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CHELMSFORD, Mass. - July 28, 2016 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $5 million order from a leading defense prime contractor for high-performance signal processing subsystems for a radar application. The order was booked in the Company’s fiscal 2016 fourth quarter and is expected to be shipped over the next several quarters.

"Mercury's renowned heritage in advanced and reliable radar signal processing subsystems and open systems architectures has ensured our continued participation in this mission-critical defense program,” said Ian Dunn, Vice President of Mercury’s Embedded Products group. "We are proud of our continuing partnership with our customer and ongoing work on high performance ISR solutions that improve U.S. intelligence capabilities in global military operations.”[Continue reading →]

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SAN JOSE, Calif. -- Cypress Semiconductor Corp. (Nasdaq: CY) today introduced a new PSoC® programmable system-on-chip that simplifies the design of next-generation industrial, home appliance and consumer systems that require multiple sensors. Many Internet of Things (IoT) applications require multiple sensors and can benefit from dedicated coprocessors that offload sensor processing from the host and reduce overall system power consumption. The new PSoC Analog Coprocessor integrates programmable analog blocks, including a new Universal Analog Block (UAB), which can be configured with GUI-based software components. This combination simplifies the design of custom analog front ends for sensor interfaces by allowing engineers to update sensor features quickly with no hardware or host processor software changes, while also reducing BOM costs.

For example, in home automation applications, engineers can easily configure the PSoC Analog Coprocessor to continuously monitor multiple sensors, such as temperature, humidity, ambient light, motion and sound, allowing the host to stay in a standby low-power mode. Future design changes to support new sensor types can also be easily implemented by reconfiguring the programmable analog blocks. Cypress will demonstrate the PSoC Analog Coprocessor, along with its PSoC, FM Flexible MCU, Bluetooth® Low Energy and Energy Harvesting Power Management IC solutions at Sensors Expo from June 21 to 23 in booth 416 at the McEnery Convention Center in San Jose. More information on the PSoC Analog Coprocessor is available at www.cypress.com/PSoCAnalog.[Continue reading →]

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Curtiss-Wright Selected by Raytheon Company to Provide Electro-Mechanical Drive for M60 and Challenger 1 Upgrades EUROSATORY 2016 (Booth #HALL 5A, Stand J761), PARIS, FRANCE – June 13-17, 2016 – Curtiss-Wright’s Defense Solutions division today announced that its Drive Technology business unit, a leading supplier of rugged, high reliability modular electro-mechanical aiming and stabilization solutions, located in Neuhausen am Rheinfall, Switzerland, has teamed with Raytheon Company to provide its cost-effective upgrade solution for modernizing the turret drive and stabilization system on M60 and Challenger 1 main battle tanks (MBT). Curtiss-Wright’s Electric Gun Turret Drive Upgrade Kit replaces older, less accurate hydraulic and hybrid-based turret stabilization systems on the M60 and Challenger 1 with a state-of-the art full electro-mechanical drive. The system provides for a lighter and safer turret that is able to rotate faster and accurately fire while the tank is on the move. Curtiss-Wright has delivered the Electric Gun Turret Drive Upgrade Kit to Raytheon Company, and supported its integration into both the M60 and CHALLENGER 1, resulting in successful live fire testing of the upgraded tanks.

“We are very proud to team with Raytheon Company to upgrade M60 and Challenger 1 main battle tanks with a modern electro-mechanical turret drive system that provides a quick, cost-effective solution for significantly boosting the performance of these older hydraulic and hybrid turret drive systems, enabling them to competitively meet the threat posed by newer and far more costly contemporary platforms,” said Lynn Bamford, Senior Vice President and General Manager, Defense Solutions division. “We are working together with Raytheon Company to provide our Electric Gun Turret Drive Upgrade Kit, which can help ensure that thousands of main battle tanks, currently in use around the world, continue to be vital and effective for years to come.”[Continue reading →]

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BERG, Germany – 21 April, 2016 – Reiser Simulation and Training (RST), a leading provider of flight simulation systems and training services, today announced that it has acquired Innovative Control Systems (ICS), a supplier of a wide range of production-proven avionics, test systems and custom engineering services for the aerospace industry. ICS is a long-time partner and supplier to Reiser and will continue to be operated as an independent company under Innovative Control Systems, LP. Terms of the agreement were not disclosed.

ICS counts more than 30 leading aerospace companies among its global customer base, including industry leaders such as Honeywell, Dassault, Embraer, Cessna, Gulfstream, Pilatus, Bell-Augusta, GE Aviation and NASA. It has a particular expertise in the area of aviation communications protocols, including ASCB and ARINC-825, ARINC-664, ARINC-717 and is a founding member of the CAN Aviation Alliance. [Continue reading →]

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San Diego, CA, February 23, 2016 * * * congatec, a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design & manufacturing (EDM) services, has added a particularly powerful graphics version to its COM Express Basic Server-on-Module portfolio. The new module features the Intel® Xeon® Processor E3-1515M v5, fast DDR4 memory and Intel® Iris™ Pro graphics. The GPU of the new SoC module provides 128 MB eDRAM and with 72 execution units it has three times more parallel execution power than the Skylake architecture without Iris graphics. Developers of tightly packed COM Express based system designs now have access to a new performance class that would have previously required a dedicated graphics unit.

Thanks to its outstanding performance, the new conga-TS170 Computer-on-Module will be in big demand for high-performance image processing applications in industrial and medical technology as well as industrial-grade IoT edge node servers and media servers with virtualization. For example GPGPU-based video transcoding, deep packet inspection or big data analytics. Further application fields include industrial thin client servers with virtual desktop infrastructure (VDI). To manage these distributed IoT, M2M and Industry 4.0 applications, the new conga-TS170 module also offers powerful server-class tools. Thanks to Intel® vPro™ technology and congatec's board management controller with watchdog timer and power loss control, the module comes fully equipped for remote monitoring, management and maintenance tasks, right up to out-of-band management. [Continue reading →]

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Multi-Module Synchronization Capability Increases the Total Number of Streaming and Recording Channels • New bundle options allow multichannel digital down conversion streaming and recording capability on wideband digital receiver • Ideal for applications in 5G, Radar and Satellite Communications, and Aerospace & Defense • Guaranteed recording time, storing all I/Q samples up to full-storage capability of host computer for long-duration frequency post-analysis[Continue reading →]

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Curtiss-Wright Corporation today announced that its Defense Solutions division has optimized its new 3U OpenVPX(tm) CHAMP-XD1 and 6U CHAMP-XD2 DSP modules to use the Intel(r) Xeon(r) processor D-1500 Product Family. The modules, which are available now with 8-core versions of the processor, will also be available with 12 and 16-core versions of the processor, which Intel will make available in the first quarter of 2016.[Continue reading →]

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San Diego, CA * * * congatec Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is introducing new COM Express basic modules parallel to AMD’s launch of its new generation of high-end embedded processors. The new conga-TR3 modules with dual- or quad-core AMD Embedded R-Series SOCs offer not only a much more broadly scalable TDP from 12 to 35 watts over earlier modules and a significantly improved performance per watt but two further prominent new features: the extremely high-performance AMD Radeon™ graphics as well as full support of the HSA specification 1.0.

“The AMD Embedded R-Series SOCs boast rich and vibrant graphics plus extremely wide scalability right down to 12 watts, so they can even be deployed in fanless, completely enclosed, and thus particularly robust designs. This significantly expands the range of applications for our high-end embedded modules based on this AMD platform,” explains Gerhard Edi, CTO of congatec AG.[Continue reading →]

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NEW VPX3-687 3U SWITCH MODULE DELIVERS 10X FASTER ETHERNET COMPARED TO EARLIER 1 GBE DESIGNS AUSA 2015, WASHINGTON, D.C. – October 12, 2015 – Curtiss-Wright Corporation today announced that its Defense Solutions division has introduced the industry’s highest density, fastest throughput 3U form factor Ethernet switch module. The new VPX3-687 1/10/40 Gigabit Ethernet (GbE) switch module is designed to address the increasing demand for 10 and 40 GbE data transfers in embedded systems. Earlier 3U OpenVPX™ Ethernet switch cards were typically limited to 2-4 ports of 10 GbE, and were only able to interconnect a couple of switches or modules. In comparison, with its 320 Gbps of line-rate switching, the fully managed multi-layer VPX3-687 provides support for up to 32 ports of 10 GbE (or 8 ports of 40 GbE) in a single 3U slot. This increased performance raises the level of Ethernet connectivity to that previously available only in 6U systems and results in significant Size, Weight, Power and Cost (SWaP-C) reduction. Validated for deployment in the harshest environments, the rugged VPX3-687 is available in both air-cooled and conduction-cooled formats.

“Our customers are increasingly turning to 10 Gigabit Ethernet to achieve levels of performance in 3U VPX systems previously only obtainable from larger and hotter 6U designs,” said Lynn Bamford, Senior Vice President and General Manager, Defense Solutions division. “We continue to expand our family of 10/40 GbE-enabled products to provide our system designers with powerful and flexible building blocks, like our new VPX3-687 module, that enable a new level of performance in SWaP-optimized small form-factor embedded systems.”[Continue reading →]

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congatec’s flat Thin Mini-ITX boards feature low-power Intel® Pentium® and Celeron® processors with powerful graphics San Diego, CA * * * congatec Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, is extending its industrial-grade Thin Mini-ITX motherboard portfolio to include graphics-rich conga-IA4 boards with 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) and full Windows 10 support. Compared to their predecessors, the new Thin Mini-ITX boards offer increased computing and graphics performance as well as support for up to three 4k displays. Despite the distinct performance gain, the power requirement has been lowered to 3 watt SDP (Scenario Design Power), which enables energy-saving, fanless system designs. With their construction height of just 20 mm, the Thin Mini-ITX motherboards allow for flat system designs and can even be integrated into slim Panel PCs.

The new industrial-grade Thin Mini-ITX motherboards are designed for deployment in applications where conventional motherboards do not suffice in terms of robustness, interference resistance, 24/7 operation as well as long-term availability. Target applications of the boards include, among others, cash register systems, scales and vending machines, gaming and digital signage applications as well as industrial HMIs, Panel PCs and thin clients in manufacturing, logistics and clinical environments. congatec’s Thin Mini-ITX motherboards are differentiated from similar industrial-grade offerings by the added value of extensive documentation as well as congatec’s integration support. Continuous software support with regular security upgrades for UEFI and software drivers round out congatec’s services.[Continue reading →]

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conga-MA4 extends congatec\'s portfolio of credit card-sized computer modules by integrating the new 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) on COM Express Mini modules. San Diego, CA * * * congatec Inc., a leading technology company for embedded computer modules, single board computers (SBCs) and embedded design and manufacturing (EDM) services, extends its portfolio of credit card-sized computer modules by integrating the new 14 nm Intel® Pentium® and Celeron® processors (codenamed Braswell) on COM Express Mini modules. The new conga-MA4 module further enhances the computing and graphics performance of their predecessors and offers a new class of performance density. Despite the increase in performance, heat dissipation has been lowered to a SDP (Scenario Design Power) of 4 Watts, enabling very compact, passively cooled system designs.

Comprehensive Microsoft Windows 10 support makes the new COM Express Mini modules ideal for system designs with state-of-the-art operating systems. The modules also make it easy to connect two 4k screens thanks to the powerful new Intel Gen 8 graphics with up to 16 execution units. The high level of computing and graphics performance is complemented by a full set of COM Express Type 10-compliant interfaces. This makes the new COM Express Mini modules the ideal choice for graphics-intense low-power applications requiring a small footprint. Typical applications can be found in high-performance banking, vending and POS terminals. Additional uses could include medical imaging, compact diagnostic workstations as well as IoT-connected industrial controls and in extremely compact and robust box PCs and thin clients.[Continue reading →]

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CHELMSFORD, Mass. - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced the results of its participation in the US Air Force-led Next Generation Radar (NGR) Processor Study. The goal of this program is to assess the capability of current embedded computing open architectures to perform airborne radar signal processing on future USAF platforms. Mercury demonstrated that its scalable and rugged high-density server modules exceeded the target benchmarks in the study, enabling affordable capability evolution of radar processors through open, non-proprietary and standards-based systems for airborne solutions.

“Mercury’s exceptional performance in this study reflects our ongoing investment and commitment to delivering the most powerful OpenVPX™ processing modules in the embedded computing industry,” said Ian Dunn, Vice President and General Manager of Mercury’s Embedded Products Group. “Now in its fourth generation, our powerful, open standards-based Ensemble® HDS660x modules meet the DoD’s expectations for affordability, security, modularity and OSA requirements and can be deployed in harsh environments to take cloud processing for military and aerospace applications right to the tactical edge.”[Continue reading →]

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Mercury will highlight OpenRFM(tm), an open architecture paradigm ideal for EW systems; server-class processing solutions that bring cloud technologies to the tactical edge; light-weight SIGINT solutions with direction finding and geolocation capabilities for UAVs, and DRFM-based systems for EW applications and training symulators.[Continue reading →]

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Cambridge Pixel is exhibiting for the first time at the Navy League Sea Air Space Expo. They will be previewing their new RS 100 RADAR/DATA Recorder at the show along with other latest versions of its radar acquisition, scan-conversion and target tracking solutions.[Continue reading →]

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NUREMBERG, Germany --Silicon Labs (NASDAQ: SLAB), a leading provider of wireless connectivity solutions for the Internet of Things (IoT), today introduced a new family of 32-bit wireless microcontrollers (MCUs) designed to simplify a wide range of IoT connectivity applications. The new EZR32 wireless MCUs deliver best-in-class power efficiency and sub-GHz RF performance and enable any application requiring longer battery life, increased wireless range, small form factor, and the flexibility to support proprietary and industry-standard wireless protocols with a single-chip device. Target applications for the EZR32 family include smart metering, wireless sensor networks, home and building automation, security systems, remote monitoring, and asset tracking.

Combining an EFM32™ MCU core with EZRadio/EZRadioPRO sub-GHz transceivers, EZR32 wireless MCUs offer developers significant advantages over conventional system designs that pair discrete MCUs with RF devices. Seamless “MCU+RF” integration frees developers from the challenge of making complex interconnections between the MCU and the radio, resulting in an easier design process and simpler board designs with less susceptibility to interference. Developers can begin their wireless designs secure in the knowledge that they are getting a fully tested, field-proven, single-chip wireless MCU solution that helps reduce component count and board size for space-constrained applications. [Continue reading →]

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4DSP announced a new high-performance PCI Express (PCIe) card today called the PC870 which provides one 10-bit analog-to-digital (A/D) channel at 5Gsps and one 10-bit digital-to-analog (D/A) channel at 5Gsps. Adapted from the Kintex UltraScale-based PC820 FPGA carrier card, the PC870 features advanced DSP capabilities, serial connectivity options, 4GB of DDR3 SDRAM, and a PCIe Gen3 interface that can support up to eight lanes.[Continue reading →]

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dSPACE MicroLabBox: New all-in-one development system for the laboratory. Wixom, Michigan: dSPACE has introduced a new, compact control system development platform for laboratory use, MicroLabBox, that offers high computing power and comprehensive functionalities. MicroLabBox makes creating, optimizing and testing controllers, and implementing data acquisition applications easy and cost-efficient for both industry and academia.

With its powerful combination of a Simulink-programmable real-time processor and the latest high-performance Kintex FPGA (field-programmable gate array), MicroLabBox provides the versatility required for research and development. It is specifically designed with an optimal form factor to not take up any more desk space than a conventional laptop computer. MicroLabBox, with over 100 I/O channels of various types, lets engineers develop innovative applications in robotics, medical engineering, electric drives, renewable energy, consumer appliances, industrial products, automotive engineering, and aerospace. [Continue reading →]

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Taipei – ARBOR Technology, a leading provider of embedded computing solutions, will be at Hall 2, stand number 2-319 at the Embedded World 2015 in Nuremberg, Germany on 24-26 February 2015. During the 3-day exhibition, ARBOR will be showcasing an array of total embedded solutions, from board to system to service, for variety of applications. Here are the highlights, and more will be displayed at the booth:

New Embedded Computing featuring the latest Intel processor – representation of a wide range of embedded computing, such as Computer-on-modules, PC/104, ATX, Mini-ITX and Miniboard. The features include Intel® Atom™ Processor E3800 and Intel® Broadwell-U CPU.[Continue reading →]

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Whether they're powering a map-sensor payload for a Global Hawk UAV or a man-pack radio system for a soldier on the move, custom computer solutions have to be small and lightweight. Oh, and while you're at it, make them ruggedized, constant in temperature, power efficient, and inexpensive.

Military contractors have been trying to solve this puzzle for years, but in almost every application, they are forced to make some tradeoffs. To meet these stringent demands, engineers have created a clever solution — modular embedded computing platforms that allow customers to design their own customized machines.[Continue reading →]

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For decades, modular embedded computer systems have been built using card cages, backplanes, and plug-in boards that perform a wide variety of functions. While it is less expensive to do something on a single board, if volumes are high and there is not...[Continue reading →]

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LinkeHope(tm) announces its new VPX payload single board computer named VP62105, a China Local-design, Local-manufacturing product. It's a modular design, based on COMexpress(r) technology, up to 4-core i7 processor from Intel(r) Ivy Bridge family. VP62105 is designed to meet harsh environment applications like rural communication, military, medical and outdoor video processing.[Continue reading →]

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CHELMSFORD, Mass. - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), a leading provider of affordable, commercially developed, open sensor processing systems and services for critical commercial, defense and intelligence applications, announced it received a $5.7 million follow-on order from a leading defense prime contractor for high performance digital signal processing subsystems and related services for a naval radar application. The order was booked in the Company’s fiscal 2015 first quarter and is expected to be fulfilled over the next several quarters.

“Mercury’s years-long relationship with this customer underscores our deep expertise in designing and building advanced radar subsystems and architectures that address the evolving needs of today’s naval environments,” said Brian Hoerl, Mercury's Vice President of Sales. “Our collaborative approach has enabled us to develop innovative solutions that meet stringent performance, reliability and affordability requirements.”[Continue reading →]

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Geneva - STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, the world’s top MEMS (Micro-Electro-Mechanical Systems) manufacturer and the leading supplier of MEMS for consumer and mobile applications[1], today announced it has shipped five billion MEMS sensors. This achievement confirms ST’s continued position as the industry leader and, combined with its total of more than three billion micro-actuators shipped, demonstrates ST is the only company with the expertise to cover the full range of micro-machined silicon devices.

Beyond gaming systems, smartphones, tablets, navigation systems, and other widely adopted applications, ST’s sensors have also been used in thousands of other useful, fun, and valuable applications including weather stations[i], bicycle helmets[ii], smart and sport watches[iii], and other sporting goods[iv] as well as a host of automotive and Internet-of-Things[v] products.[Continue reading →]

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LIBERTY, SC, USA – Sealevel Systems, Inc., announces the Relio R4 industrial computer designed for applications requiring flexible I/O configurations in a compact 1U rackmount design. Based on COM Express architecture, the system offers high reliability, scalable processing and a long product life cycle. Available with a choice of Intel dual-core Atom, Core i3 or Core i7 processor, the system is ideal for remote monitoring, test and measurement, and data acquisition applications.

The Relio R4 system is packed with standard I/O features including dual Gigabit Ethernet, five USB 2.0 ports, one RS-485 and two RS-232 serial ports, DisplayPort and VGA video. Two SeaRAQ™ I/O expansion slots are accessible through the rear of the enclosure that enable a variety of real-world analog I/O configurations such as A/D inputs, 0-20mA inputs, thermocouples, RTD inputs, and 4-20mA outputs. Optically isolated inputs, relay outputs and additional serial interfaces are also available. [Continue reading →]

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Newport, Isle of Wight, UK - RFEL, who specialises in high performance, electronic video and signal processing solutions, in collaboration with KTK Kommunikationstechnik, GuS and Rheinmetall Defence, will be launching an advanced fused Driver Vision Enhancement (fDVE) solution at Eurosatory (www.eurosatory.com).

Typical sensor types used for defence applications are daylight sensors (mostly CCD), lowlight sensors (image intensifier tubes) or thermal imaging sensors (MWIR/LWIR). Each type of sensor has its specific advantages and disadvantages. Whilst daylight sensors are good in daylight conditions, they tend to be bad in lowlight conditions. On the other hand, thermal imaging sensors excel in daylight or lowlight situations but tend to show less detail. The typical solution is to blend daylight and thermal imaging but this results in a loss of contrast and definition relative to the original daylight image.[Continue reading →]

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