Extreme Engineering Solutions (X-ES) is pleased to offer X-ES Enterprise Linux (XEL) - a Board Support Package (BSP) that enables the use of an Enterprise Linux distribution in conjunction with X-ES rugged, embedded computing hardware.[Continue reading →]
IoT Reference Platform, from embedded systems experts Abelon Systems, is Bluetooth 5 - ready
The Internet of Things (IoT) is the inter - networking of devices embedded with electronics (including sensors, actuators and network connectivity) and software that enables those devices to collect and exchange data. According to Gartner there will be nearly 21 billion devices on the IoT by 2020. [Continue reading →]
The BACnet Explorer NG is the industry's first cloud-connected network discovery and management solution for BACnet networks. BACnet is an industry-standard protocol that is widely used in building and facility automation. The BACnet Explorer NG enables integrators, facility managers, and the OEMs' installation channels to conveniently commission new devices into existing BACnet networks. Progressive solution providers can also leverage the BACnet Explorer NG and FieldPoP device cloud to provide a range of new services to their clients such as continuous facility monitoring and maintenance-as-a-service. This is the BACnet Discovery tool every network and system installer/technician and facility manager needs and wants.[Continue reading →]
Portwell's XM-1, the first IoT gateway to feature international patents of highly composable structure, satisfies customers' requests for an IoT gateway solution that can meet the requirements emerging from an extensive range of IoT applications. And the Portwell DS-1 wireless sensor node series features support for Arduino IDE and a wide variety of options for sensors and wireless connectivity.[Continue reading →]
Powered by Intel(r) Xeon(r)/Core(tm) i7 (Kaby Lake) processor running with NVIDIA GeForce(r) GTX 1050 graphics engine, advanced NVIDIA Pascal(tm) GPU architecture supporting 8K resolution & CUDA applications, up to 6 independent HD displays, all-in-one integrated features, multiple I/O connection, workstation-grade system performance, mobile availability, smart manageability, wide range power input, surge protection, ignition power control, smart battery protection, isolated DIO, EN50155 and industrial-grade reliability, Vecow ECS GTX1050 Series GPU Computing System is your great solution for any performance driven Industry 4.0/IIoT applications.[Continue reading →]
The MEMSIC product line at Mouser Electronics features a variety of sensor products, including magnetic and e-compass products, accelerometers, 6-degree-of-freedom (DOF) and 9-DOF inertial measurement units (IMUs) and orientation sensors, and gas flow modules. The MEMSIC product line enables mobility and the Internet of Things (IOT) by combining all the essential elements for engineers' application needs, including solutions for drones, mobile, wearable, industrial, medical and smart parking applications.[Continue reading →]
COMMELL has released two new embedded boards LP-177 Pico-ITX 2.5-inch and LE-37F 3.5-inch Miniboard with Intel the latest low-power quad-core Pentium processor or dual-core Celeron processor[Continue reading →]
ST. LOUIS and CHENNAI, India – April 12, 2017 - e-con Systems Inc., a leading embedded camera solution company, today announced the launch of See3CAM_81, an 8 megapixel Autofocus USB 3.0 camera. See3CAM_81 is based on the 1/3.2-inch OV8865, an 8 MP CMOS image sensor from OmniVision. See3CAM_81 is a successor to e-con Systems’ hugely successful 8MP autofocus USB 3.0 camera, See3CAM_80 based on OV8825.
The See3CAM_81 streams uncompressed video 720p@60fps (HD), 1080p@30fps (cropped) and 8 MP@ 11 fps in YUY2 formats over USB 3.0 interface. See3CAM_81 features high performance Image signal processor (ISP) that provides superior high and low-light images, making this camera ideal for customers designing kiosk, multimedia applications, high resolution OCR, barcode scanning applications and medical and scientific applications such as tissue vision, pathology examination and microscopic applications[Continue reading →]
CAMBRIDGE, United Kingdom, 12th April 2017: UltraSoC and Moortec Semiconductor today announced that they are cooperating on system-on-chip (SoC) monitoring and analytics intellectual property (IP) to enable a new generation of Process, Voltage and Temperature (PVT) sensor sub-systems.[Continue reading →]
Leti, a research institute of CEA Tech, is marking its 50th anniversary this year during industry events and workshops in Grenoble, Tokyo, and Taipei and at both SEMICON West and IEDM 2017 in San Francisco.[Continue reading →]
Fujitsu Components America, Inc. and enmo Technologies, a leader in mobile IoT, today announced a technology collaboration to support Fujitsu IoT devices in the enmo Platform. The first result of this collaboration is that the Fujitsu Sensor Beacon IoT device now is supported in the enmo Platform.
“We worked very closely with enmo to port their IoT.Over.BeaconTM technology to our Sensor Beacon IoT device,” said Bob Thornton, president/COO of Fujitsu Components America. “Complete Smartphone Apps for IoT deployments that use our Sensor Beacon now can be developed and launched in minutes through the enmo Platform. We look forward to continuing to work with enmo to have their Platform support other Fujitsu IoT devices, such as our Blue Brain module.”[Continue reading →]
Vpai and HTC Vive Taipei, Taiwan, March 22, 2017 - VIA Technologies, Inc., today announced that it will be demonstrating its first generation of Vpai 720-degree cameras at the HTC Vive Ecosystem Conference 2017 that takes place from March 27th – 28th in Shenzhen, China.
“With their ability to shoot and render stunning panoramic video on the fly, Vpai 720-degree cameras open up exciting new possibilities for creating captivating visual experiences for the HTC Vive,” said Richard Brown, VP International Marketing, VIA Technologies, Inc. “We look forward to exploring opportunities for cooperation with developers at the HTC Vive Ecosystem Conference 2017.” [Continue reading →]
Taipei, Taiwan, March 22, 2017 - VIA Technologies, Inc., today announced the launch of the first generation of Vpai 720-degree cameras in China. The devices can be ordered online in China for prices of less than US$100.
Available in a choice of stylish ultra-portable form factors, the seven models enable consumers to easily capture, view, and share their experiences in stunning panoramic image and video formats. The user-friendly Vpai app combined with Wi-Fi and USB connectivity options makes operating the cameras a snap in any environment, whether at a dinner with friends or out on the hiking trail. [Continue reading →]
New York, March 7, 2017 - MicroMax today introduced two new high-end, high performance rugged systems based on the VITA 75 standard. The M-Max 871 EP4/MMS and M-Max 771 PR7/MMS both employ the newest M-Max V75 chassis.[Continue reading →]
Based on the Hyperstone U9 Flash controller, Micron's new eU500 is a fast, reliable and small embedded USB device which provides a highly reliable Flash storage system targeted at telecommunication, networking, industrial/embedded and IoT applications.[Continue reading →]
TE KILOVAC KCS01 Contactor TE Connectivity (TE), a world leader in connectivity and sensors, has released an additional size for the KILOVAC current-sensing [KCS] high-voltage contactors. The KILOVAC KCS01 contactor is a compact power-switching solution with an integrated current sensor and current trip function. These contactors are suited for applications in harsh military and commercial electric vehicles, power distribution, energy storage and battery storage systems.
For over 35 years, KILOVAC products have been used to deliver high-voltage switching capabilities demanded by aerospace and defense applications. KILOVAC contactors are highly specialized for use in critical applications with high current systems. The KCS01 contactor extends the KILOVAC contactor line abilities with its ruggedized lightweight design. These contactors are hermetically sealed to optimize and extend performance in harsh, explosive and corrosive environments, even after periods of non-use.[Continue reading →]
uCOM-AL6C Ubiqconn Technology, an innovative manufacturer specializing in Embedded IoT and Industrial 4.0 solutions, today introduced its COM Express Compact Type 6 module - uCOM-AL6C, empowered by the latest 14nm Intel® AtomTM E3900 series processors, formerly Apollo Lake-I. The adoption of the latest Intel® AtomTM CPUs offers enhanced processing power, real-time computing and lower power consumption on a compact 95x95mm2 COM Express module. uCOM-AL6C is designed to fit the demanding requirements in Embedded IoT, smart factory, smart edge gateway and other Industrial 4.0 related applications which design of power and space is critical.
Intel® AtomTM x5-E3930, x5-E3940, or x7-E3950 SoC processor offers frequency up to 2.0GHz and TDP as low as 6.5 Watt or above. The adoption of the new Intel® 14nm AtomTM SoC series also delivers IoT-oriented platform features including DDR3L-1,600 SO-DIMM up to 8GB, conflict-free Embedded Options Available, Intel® Gen9 Graphics 505/500 with 4K support and Intel® Quick Sync Video. These technological enhancements enable uCOM-AL6C to function as a core in Embedded IoT and Industrial 4.0 applications, such as production system gateway, automated factory monitoring, real-time sensor data processing, and factory control box.[Continue reading →]
RANCHO CUCAMONGA, Calif., February 14, 2017 – General Micro Systems, Inc. (GMS) today announced the S1U-MD, a 1U rackmount, multi-domain server and managed Ethernet switch/router based on the Intel® Xeon® D server CPU. S1U-MD boasts 12x the performance of traditional blade-servers, but in one-twelfth the size of traditional systems.
Isolating Red and Black domains to ensure security or designing for redundancy is normally accomplished with one full-depth box for each Red and Black domain: 1) two physically separate servers, 2) two separate Ethernet multi-port switches; and 3) two separate routers. Putting this capability into a single, 1U high and 17-inch deep (Short Rack) server blade is another GMS engineering phenomenon in small form factor rugged systems. S1U-MD takes one-twelfth the rack space of a competing multi-domain solution.[Continue reading →]
KILOVAC KCS03 CURRENT-SENSING HIGH-VOLTAGE CONTACTOR HARRISBURG, Pa. – February 7, 2017 – TE Connectivity (TE), a world leader in connectivity and sensors, recently introduced the KILOVAC current-sensing (KCS03) High-Voltage contactor, featuring an integrated current sensor with current trip function. KILOVAC current-sensing contactors eliminate the need for discrete current sensors, saving weight and space in military and commercial electric vehicles, power distribution and energy storage systems.
TE’s current-sensing contactors simplify configuration needs within rugged applications through its small size and flexible configuration. The sensor function includes a programmable trip, which allows immediate, delayed, or disabled trip. These contactors are hermetically sealed for reliable performance in most harsh, explosive and corrosive environments. [Continue reading →]
Libelium brings over the Internet of Things to Industry 4.0 offering new applications for factory automation, automotive applications, industrial networking, building and infrastructure, transportation, energy applications and military uses. The compatibility added with new industrial protocol modules and API libraries for Plug&Sense! Sensor Platform allows connecting to the Cloud sensor information coming from industrial devices.
The new modules support the most widely used industrial communication network protocols such as RS-232, RS-485, CAN Bus, and Modbus, used for process as varied as industrial automation, building automation and automobile applications, for sensor network capability in remote or factory floor environments. In conjunction with the new modules, Libelium has released a special Plug & Sense! model to connect 4-20 mA sensors (current loop), the most commonly deployed in industrial environments.[Continue reading →]
Opticon has expanded its range of OEM scan engines by introducing an ultra-thin 2D Imager: the MDI-4100. With its extremely small size measuring just 10mm thickness, the MDI-4100 can be easily integrated into the most compact devices and spaces such as POS Systems, PDA's, companion scanners, handheld terminals and ticket readers.[Continue reading →]
The European INSPEX project will develop a multi-sensor and low-power spatial-exploration and obstacle-detection system for applications that guide the visually impaired, as well for robotics, drones and smart manufacturing. It will provide real-time, 3D detection, location and warning of obstacles under all environmental conditions.[Continue reading →]
• Industrial Internet Control System from GE greatly improves operational equipment efficiency and enables quantum leaps in productivity • Unique solution combining connected machine controllers with cloud connectivity, advanced analytics software and apps for plant and asset control in real time[Continue reading →]
ANSYS 18 delivers a new approach to engineering by deploying simulation across the entire product lifecycle - referred to as pervasive engineering simulation. Pervasive engineering simulation performs a central role in all aspects of the product lifecycle - from concept, through engineering design and into operations. Engineers, from the novice to the highly experienced, can now use engineering simulation software across the entire product lifecycle with the newly released ANSYS® 18. This next generation of ANSYS’ (NASDAQ: ANSS) industry-leading engineering simulation solutions builds upon decades of cutting-edge technology for the most complete and accurate digital prototypes across all major physics, electronics and embedded software areas. This feature-rich release expands the boundaries of simulation upfront in the development process to digital exploration as well as downstream with digital twins, expanding simulation to the operations and maintenance of products.
Today’s industries are undergoing a fundamental transformation in manufacturing and product development. Trends like the Internet of Things, additive manufacturing and machine learning are merging the physical and digital worlds, creating an unprecedented pace of product innovation. The opportunity is immense, but also creates incredible levels of complexity across the entire product lifecycle.[Continue reading →]
HARRISBURG, Pa. – January 31, 2017 – TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, has released its next generation ACT composite connectors within the DEUTSCH MIL-DTL-38999 series. The ACT series circular connectors are among the most versatile and popular circular mil spec input/output connectors in the world. These circular connectors offer composite shells providing up to 40 percent weight savings over aluminum connectors.
MIL-DTL-38999 connectors are widely used throughout the world in military, defense and commercial avionics applications. TE’s DEUTSCH group created one of the original composites in 1990, and has continued to upgrade and improve its products to match industry standards. The ACT series composite shells are among the lightest weight, the most resistant to corrosion and the most durable, offering 1,500 mating cycles.[Continue reading →]
Rueil-Malmaison, France, January 31th 2017 - SBG Systems releases a new version of the Ellipse Series, its popular product line of miniature inertial sensors. The Ellipse has been greatly improved, showing unmatched performance in attitude measurement while adding Galileo constellation to its GNSS receiver.[Continue reading →]
ADQ7 in MTCA form factor ADQ7 in MTCA form factor SP Devices, an e2v company, has launched the ADQ7, the first digitizer to offer an unrivalled combination of 14-bits vertical resolution and a sampling rate of up to 10 GS/s.
The ADQ7 hosts a powerful Xilinx Ultrascale XCKU060 FPGA which is made available to the user through a firmware development kit. In addition, to help shorten design time, there are a number of optional stand-alone firmware packages containing application specific, real time signal processing functions. These flexible firmware solutions make the ADQ7 the perfect platform for Original Equipment Manufacturer (OEM) integration.[Continue reading →]
CHELMSFORD, Mass. - Jan 30, 2017 - Addressing the need for tighter in-vehicle security, Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), today announced the CANGuard™ security suite, a unique software solution designed to protect automotive vehicle data networks. The Company also announced that it has entered into a licensing agreement with a leading automotive electronics manufacturer to enable the integration of CANGuard software into existing vehicle control units as well as future units.
Security breaches of in-vehicle onboard computers and networks are becoming more prevalent. Recent demonstrations range from remotely shutting down an engine to causing vehicle brakes to malfunction. Such attacks are enabled by the lack of built-in security for the vehicle’s controller area network (CAN) bus—the technology linking most onboard computers. CAN has been a reliable workhorse for the automotive industry for decades, yet it was developed before the Internet, so its inventors never considered malicious remote actors having access to the bus. By compromising a network-enabled onboard computer, a sophisticated hacker can gain access to other critical vehicle systems via CAN, leading to the dangerous security breaches recently reported in the media.[Continue reading →]
The latest 7th generation Intel Core i7/i5/i3 processor running with Intel C236 chipset, fanless -40°C to 75°C extended temperature, workstation-grade system performance, all-in-one integrated features, 10 independent GigE LAN with 4 X-coded M12 IEEE 802.3at PoE+ and 4 PoE+, 4 SSD trays, 2-port CAN Bus, outstanding mobile availability, smart manageability & power protection, and rugged reliability, Vecow IVH-9200MXC and ECS-9200MXC Series Fanless Embedded Systems are your performance-driven solution for real-time Industry 4.0/Industrial IoT applications.[Continue reading →]
The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today released MIPI I3CSM, Improved Inter-Integrated Circuit, a sensor interface specification that streamlines sensor integration in smartphones, wearables, Internet of Things (IoT) devices and automotive systems.
“Today’s release of MIPI I3C is an important milestone for MIPI Alliance and the developer community because it brings together multiple sensor interface approaches around a unifying specification that provides conveniences and system-level benefits for many applications,” said Joel Huloux, chairman of the board of MIPI Alliance. “We expect MIPI I3C will play a fundamental role in expanding opportunities for sensor-based applications in mobile, mobile-influenced and embedded systems markets.”[Continue reading →]
Workstation-grade Intel(r) Xeon(r) processor running with Intel(r) C236 chipset, fanless -40°C to 75°C extended operating temperature, excellent system performance, all-in-one integrated features, 4 SSD trays, 6 independent GigE LAN with 4 M12 IEEE 802.3at PoE+, outstanding mobile availability, smart manageability, 6V to 36V power input with 80V surge protection, ignition power control, intelligent circuit protection and rugged reliability, Vecow IVH-9200 Series Fanless Embedded System is your performance-driven solution for real-time Industry 4.0/ IIOT embedded applications.[Continue reading →]
LoRa Alliance(tm) members myDevices, the Internet of Things solutions company; Senet, the first and fastest growing North American provider of public, low-power, wide-area networks (LPWANs) for long-range Internet of Things (IoT) applications built on the LoRaWAN(tm) protocol; and STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced that they have collaborated to showcase demonstrations of the first real-time, multi-target location tracking using the LoRaWAN low-power, wide-area network (LPWAN) protocol along the Las Vegas Strip during CES 2017.[Continue reading →]
The ASUS Zenfone AR is the company's first smartphone with support for Google TANGO augmented reality technology. A key part of TANGO is a depth-sensing camera module design with the Infineon REAL3 image sensor.[Continue reading →]
Press Release:-New Delhi, India BalaJi MicroTechnologies is happy to release ultra high paaerforamance Line aScan Camera for machine vision & factory automation applicaatioans.With stroang in-house R&D & design efforts, we are happy to intrAoduace wide range of line scan cameras which produces high quality images.
Key Features: [Continue reading →]
Advancements in processor technology mean that engineers and designers are able to meet the demand of signal-processing requirements in applications ranging from radar and software-defined radios to high-performance embedded computing (HPEC), and space systems. Designing for exacting high- bandwidth as well as size, weight, and power (SWaP) requirements are no longer a major challenge, but now are simply a checkbox in the design process. Even so, challenges remain, but designers are finding ways to face those issues by using fiber-optic technology, multicore processors, commercial off-the-shelf (COTS) components, and codesign methodologies.[Continue reading →]
Industrial 4.0 changes the manufacturing industry, but also changes the industrial automation product design concept. With a variety of actuation / drive devices, controllers and sensing units become more intelligent, and even in the field to automatically determine the situation, the traditional industrial control systems play a role in the industrial computer, in addition to the System to find a new location, the product design concept began to change. Such as industrial computers will become more energy efficient, more compact, and easier to mount or integrate with other devices.[Continue reading →]
United Electronic Industries (UEI) today announced that its new high performance ARINC-429 interface I/O board, the DNx-429-516, is available for purchase. This 16-channel board is fully compliant with the ARINC-429 specifications and supports both high speed (100 kHz) and low speed (12.5 kHz) operation.[Continue reading →]
‘OWLY-EYED’: NEXT-GEN LOW-NOISE IMAGING TECHNOLOGY DEVELOPED BY LETI FOR FRENCH SME PYXALIS
Technology Targets Medical, Security, Defense, Scientific-imaging and other Markets. [Continue reading →]
StarChip, a dynamic semiconductor company (subsidiary of Safran Identity & Security), and Cortus, a technology leader in low power, 32-bit processor IP, today announced a new strategic collaboration to deliver secure solutions for today's interconnected world against complex security threats[Continue reading →]
When talking about Automation 4.0 or Internet of Things, it is never an easy job that can be accomplished by a single technical people, a task force or even a company. The IT people needs to learn Modbus, PLC logic, low level C language for I/O control and the OT people needs to know about database, ERP, and web technology. To bridges the technology gap between these two groups of people, Artila provides a ready to go IoT gateway, Matrix-700 embedded computer which supports Linux OS and Node-RED.[Continue reading →]
Boston, MA, USA – November 2, 2016 – PrismTech™, a global leader in software platforms for distributed systems, today announced the availability of its open source Future Airborne Capability Environment (FACE™) 2.1 Transport Services Segment (TSS) reference implementation.
PrismTech has developed the open source FACE 2.1 TSS reference implementation for use with its Vortex™ OpenSplice™ product, the leading (open source and commercial) implementation of the Object Management Group®'s (OMG®) Data-Distribution Service™ (DDS™) standard. PrismTech’s open source TSS reference implementation provides a mapping-layer between the FACE Transport Services (TS) Application Programming Interface (API) and the standard OMG DDS API. The new TSS implementation supports both C++ and Java APIs and enables portable components to share and exchange data using DDS. PrismTech’s TSS reference implementation is being made available under GNU Lesser General Public License (LGPL) v3 open source license terms.[Continue reading →]
The product launch improves the sensor nodes Waspmote and Plug & Sense! and the IoT gateway Meshlium making them faster, more accurate, energy-saving and compliant with the latest radio and cloud technologies in the market. This new generation adds more than 10.000 developers' feedback.[Continue reading →]
PHOENIX, AZ – Nov. 1, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, is bringing the advanced global shutter imaging performance of the PYTHON CMOS image sensor family to a cost-effective, small-footprint design.
The new PYTHON 480 image sensor shares the same pixel design and SVGA (800 x 600 pixel) resolution as the existing PYTHON 500, but is optimized for both size (with a package 85% smaller than the existing device) and power. Large 4.8 µm global shutter pixels with two available microlens offset options enable high light sensitivity in end-use cases ranging from inspection systems (where short exposure times enable the capture of moving objects without motion blur) to barcode scanning (where large depth of field and small scanning engines are needed). The new device preserves the imaging performance of the PYTHON family of CMOS image sensors while supporting readout speeds of up to 120 frames per second (fps) through either a single-lane LVDS or parallel output.[Continue reading →]
The TXMC590 is a standard Switched Mezzanine Card (XMC) compatible module offering 16 channels capable of measuring thermocouples, resistive sensors like RTD and thermistors, and strain gauges. Released as an extension to TEWS' growing portfolio of XMC modules, the TXMC590 is designed for industrial control, telecommunication infrastructure, medical equipment, traffic control and COTS applications.[Continue reading →]
See groov bridge the gap between existing industrial assets and infrastructure, and the digital world of cloud computing and information technology in Hall 1 Stand F725; Node-RED software development environment now included in the industrial HMI/dashboard/data logging groov(r) Box.[Continue reading →]
In all areas of business, increased communication leads to more streamlined processes and greater potential for success. This is no less true in system design. Within large design organizations, baseband field programmable gate array (FPGA) and radio frequency (RF) signal processing communities have traditionally been separated both physically and by the resources available to them--with each group using very different techniques and tools. Today, however, many RF functions are moving into the algorithmic world and this is making communication between the two areas more crucial than ever.[Continue reading →]
AUSTIN, Texas – Sept. 27, 2016 – Cirrus Logic (NASDAQ: CRUS) is enabling a dramatic leap forward in single-chip audio and voice processing features for mobile applications with the introduction of its flagship low power smart codec. The Cirrus Logic CS47L90 offers mobile device manufacturers the ability to provide new innovative voice features with audio technology that allows consumers to enjoy a high-fidelity listening experience from their mobile devices.
“Always on” voice activation, noise reduction, active noise cancelation, echo cancelation and speaker protection features empower consumers with greater voice control over their mobile device while delivering a superior, noise-free audio user experience. The CS47L90 provides a premium listening experience with SmartHIFI™ audio playback. SmartHIFI from Cirrus Logic is a unique combination of powerful DSP processing and high-performance analog circuits to deliver an audio experience typically associated with high-end audio equipment, now optimized for mobile audio playback. The CS47L90’s ultra-low power consumption, both in standby and operational modes, also enables significant battery life savings. [Continue reading →]
In this paper, we will compare a software-based motion control system using KINGSTAR soft Motion to the traditional approach of using DSP-based hardware that plugs into the motherboard of your PC. We will show that the software-based servo performance is equivalent to or better than the DSP solution, with a number of advantages compared to hardware at a very affordable price. [Continue reading →]