Air Flow-By Cooling Technology From Mercury Systems Achieves TRL-8 - HDS6603_AFB ANDOVER, Mass. - May 16, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced that systems using ANSI/VITA 48.7 Air Flow-By™ standard cooling technology have passed flight tests in multiple manned and unmanned airborne platforms, some in their final mission configuration, thereby achieving technology readiness level 8 (TRL-8). Mercury holds a patent on one implementation approach of that standard, and has revised the licensing fees under the patent to be zero cost.
Mercury Systems developed Air Flow-By cooling technology as an improvement to its finely managed air cooling, the original air flow-through (AFT) technology it developed back in 2003. Air Flow-By cooling technology is the most efficient solution on the market to achieve a sealed environment that tolerates cooling with air that may contain contaminants. Unlike today’s AFT technology that merely adds an airflow heat exchanger to the primary side surface of a printed wiring board (PWB), Air Flow-By solutions cool both sides of the PWB by encapsulating the PWB in a heat exchanger shell such that air flows across both sides of the module for maximum cooling efficiency. The heat exchanger shell creates a sealed environment that protects against airborne contaminants, electromagnetic interference (EMI), electrostatic discharge (ESD), and provides an extra layer of physical security. Even with the increased protection and cooling capacity, Air Flow-By solutions maintain the standard 1.0-inch pitch to avoid a 33% reduction in board count found in AFT implementations that may require the module width to grow to 1.5-inch pitch. Now, Air Flow-by technology also has a cost advantage with its zero-cost licensing. [Continue reading →]
SANTA CLARA, Calif.-- INTERNET OF THINGS WORLD -- Avnet (NYSE: AVT), a leading global technology distributor, will showcase how the Internet of Things (IoT) impacts daily life in its “Smart Neighborhood” at Internet of Things World, May 16-18 at the Santa Clara Convention Center. In Booth #302, Avnet will demonstrate smart home and smart city technology featuring its customers’ products and Avnet-designed development kits. Avnet’s Smart Neighborhood at IoT World underscores how the company helps its customers bring IoT innovations to market at every stage of the technology product lifecycle.
“IoT is about the things, and the data that these things collect, to enhance our lives every day,” said Lou Lutostanski, Avnet’s vice president, Internet of Things. “Avnet helps guide IoT solutions to market that are born out of the ideas of companies of all sizes, from small startups to large multinational companies. Bringing together innovative solutions across industries into one Smart Neighborhood shows the true potential of Avnet’s approach to IoT in the real world.” [Continue reading →]
The Global Image Recognition Market is expected to reach a market size of $ 42,246 million by 2022, growing at a growth rate of 18.0 % during the forecast period. Hardware market would lead the Global Image Recognition market attaining a market share of 50.0% by 2022.[Continue reading →]
/ins.Concept Sweden AB is a young company, but they have many years of experience within the field of automation. Situated in Gothenburg, on the west coasts of Sweden, a group of experienced engineers and young blood in the line started the automation company in 2011. The startup has been very successful with an average growth rate of more than 25% per year. They have had a high annual profitability right from the start, and their new waterjet cutting machine investment has improved profitability even further.[Continue reading →]
Electronics Architecture Evolution Towards Automated Driving
An autonomous car is the main vision of the automotive industry for the next decade. In 2017, many OEMs started implementing intermediate milestones through advanced driver assistance (ADAS) functions to achieve a fully autonomous car. From the industry point of view, realizing the new technology with reasonable costs and reliability is a key requirement for deploying autonomous cars. [Continue reading →]
New Delhi and Aix-en-Provence: Logic Fruit Technologies, one of the world's foremost providers of Design Services & IPs Cores and Accelize, the leading accelerator content provider for FPGA Acceleration-as-a-Service have announced a new strategic partnership. The partnership will combine Logic Fruit’s expertise in Design Services, Video & Security IPs Cores with Accelize’s market leading Cloud workload FPGA acceleration technologies to deliver solutions for today’s increasingly data rich world.
Logic Fruit has joined Accelize’s QuickAlliance™ network, a group of world’s top high-quality IP providers and FPGA accelerator developers, offering their services through Accelize’s QuickStore® for plug-and-play configuration of FPGA accelerators. These accelerators are in turn available in various Cloud Service Providers marketplaces to be sold as a service to their end users.[Continue reading →]
Mercury Systems 4BG_DDR3_High-Density ANDOVER, Mass. - May 4, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced that it has launched production of a highly miniaturized DDR3 memory device perfectly suited for SWaP-sensitive military and commercial aerospace applications demanding 1600 Mb/s data transfer speed. Mercury’s precision-engineered packaging technology now compacts 4GB of double data rate third-generation synchronous dynamic random-access memory (DDR3 SDRAM) in a single 301 mm2 ruggedized package, setting the industry standard for the highest density DDR3 device. The new 4GB DDR3 high density secure memory product, available in x64 and x72 architectures, is manufactured at Mercury’s Advanced Microelectronic Center in Phoenix, Ariz.
Next-generation mission computing and sensor subsystem designs need additional DRAM capacity for simultaneous processing of numerous wideband data streams. While attempting to double or triple the number of discrete DRAM devices, system architects frequently encounter a scarcity of available space for integration of these components. Mercury’s newest memory product surmounts this space restriction by vertically integrating the equivalent of up to five DDR3 memory devices into one densely-packed, low-profile ball grid array (BGA) package less than 2.5 mm thick. Physical footprint reductions up to 59% are realized without compromising the benefits of high-capacity DDR3 memory. For the highest levels of reliability, the integrity of the mechanical and electrical interface to the customer’s subsystem is assured through the selection of a lead alloy solder.[Continue reading →]
W. L. Gore & Associates, Inc. (Gore) announced today that GORE-FLIGHT(tm) Microwave Assemblies and GORE(r) Microwave/RF Assemblies for military aerospace applications have successfully passed stringent U.S. Army flight qualifications on the MH-47 Rotorcraft[Continue reading →]
Mercury Systems Unveils First 3U Transceiver ANDOVER, Mass. - April 26, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced the Ensemble® DCM-KU-4R2G-2T3G ultra-low-latency transceiver developed to meet the demanding requirements of advanced electronic warfare (EW) applications and to provide high-speed signal processing capability suited to ultra-wideband communications and synthetic aperture radar (SAR) applications. Designed in accordance with OpenVPX™ standards at Mercury’s Huntsville, Ala. facility, the new transceiver is optimized for low probability of interception (LPOI) radio frequency (RF) signal detection in heavily contested electromagnetic environments. Ideal for digital radio frequency memory (DRFM) applications, Mercury’s new product seamlessly couples coherent multi-channel, multi-board functionality with best-of-breed spectral purity in a 3U form factor ruggedized for harsh military environments.
Modern military forces rely increasingly on electronic warfare technologies to secure a competitive advantage prior to physical engagement with an adversary. At the same time, commercial applications, such as wireless data and voice transmission signals, crowd the spectrum, virtually masking electromagnetic signals of military interest. Maintaining a dominant position on the electromagnetic battlefield necessitates simultaneous discernment of small signals over a wide bandwidth of frequencies with exceptional precision. Swift identification of these signals is critical to generate an appropriate and timely response to recognized threats. Mercury’s newest innovation addresses this signal detection challenge by densely integrating state-of-the-art RF and digital technologies to maximize spectral efficiency while simultaneously reducing physical size and weight. [Continue reading →]
A new demonstrator combines two cutting-edge technologies that include the RH850/V1R-M microcontroller (MCU) from the Renesas autonomy Platform and ADI's Drive360 advanced 28nm CMOS RF-to-bits technology.[Continue reading →]
NEWTON, Mass., April 25, 2017 (GLOBE NEWSWIRE) -- Sensors Expo & Conference (#Sensors17) the nation's leading event focusing exclusively on sensors and sensor-integrated systems, today announced details of a new Automotive & Autonomous Vehicle Sensors Workshop to take place on Wednesday, June 28. Spearheaded by Willard Tu, Executive Vice President, DSP Concepts, Inc., the half-day workshop will feature a series of panel discussions focusing on sensors and their role in automotive and autonomous vehicles. In addition, the Autotech Council will host a “Startup Review” to highlight new and exciting startups in the automotive sensing industry on Wednesday, June 28.
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ANDOVER, Mass. - April 18, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $9.3 million order from a leading defense prime contractor for high performance, OpenVPX™ digital signal processing modules and supporting professional services for a manned airborne radar application. The order was received in the Company's fiscal 2017 third quarter and is expected to be shipped over the next several quarters.
“We have a longstanding relationship with this customer in providing high performance signal processing solutions for airborne radar,” said Ian Dunn, Vice President of Mercury’s Sensor and Mission Processing group. “By adopting our new OpenVPX product line, our customer now has a cost-effective, modular open systems architecture that protects their long-term investment in software by providing them an easy path to port their application to an affordable high-performance processing solution.”[Continue reading →]
The embedded box PC TANK-870-Q170 from ICP Deutschland is especially made for the usage in image processing applications. It combines an optional POE expansion, RAID function and different PCI, PCIe and PCIe MIni Card expansion possibilities.[Continue reading →]
Fujitsu Components America, Inc. and enmo Technologies, a leader in mobile IoT, today announced a technology collaboration to support Fujitsu IoT devices in the enmo Platform. The first result of this collaboration is that the Fujitsu Sensor Beacon IoT device now is supported in the enmo Platform.
“We worked very closely with enmo to port their IoT.Over.BeaconTM technology to our Sensor Beacon IoT device,” said Bob Thornton, president/COO of Fujitsu Components America. “Complete Smartphone Apps for IoT deployments that use our Sensor Beacon now can be developed and launched in minutes through the enmo Platform. We look forward to continuing to work with enmo to have their Platform support other Fujitsu IoT devices, such as our Blue Brain module.”[Continue reading →]
Mercury Systems Defense DDR4 High Density Secure Memory Device CHELMSFORD, Mass. - March 2, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced the latest development in its high density secure memory product line, integrating double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) with its SWaP-efficient packaging technology. Replacing up to eighteen industrial or commercial DDR4 devices with a single military-hardened component, Mercury delivers space savings up to 75% in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Mercury’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz., will produce 8GB DDR4 devices in the second half of 2017 to support next-generation customer designs. 2GB and 16GB devices are slated for production thereafter.
“Since pioneering the first DDR high density secure memory devices more than 15 years ago, our miniaturization technology has advanced with each successive generation of DDR memory,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our memory solutions are optimized for density while withstanding the harshest operating environments. With today’s announcement, Defense prime contractors now have a trusted supplier of compact, military-grade DDR4 memory for high-speed, low-power, mission-critical subsystems.”[Continue reading →]
With voice control emerging as a primary interface to consumer electronics, differentiating a single voice from other speakers and background noise is essential to creating a positive user experience. Infineon and XMOS have teamed on a demonstrator design of an enhanced voice controller system. Shown this week at MWC in Barcelona, the demo system combines Infineon's single-chip 60 GHz radar IC and 70db SNR microphones with an XMOS audio processor to handle intelligent beamforming for far field voice capture.[Continue reading →]
HARRISBURG, Pa. – January 12, 2017 – TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, has released its DEUTSCH autosport hermetic fuel tank connector range with an aluminum shell. The new connector replaces standard stainless steel materials with aluminum to achieve a 60 percent weight savings.
Designed for the professional motorsport industry, the fuel tank connector goes into the wall of a fuel cell with a glass seal to stop any fuel escaping up the wiring loom.[Continue reading →]
SCHAFFHAUSEN, Switzerland – January 11, 2017 – TE Connectivity Ltd. (NYSE: TEL) (TE), a world leader in connectivity and sensors, was named one of Clarivate Analytics 2016 Top 100 Global Innovators. This marks the sixth consecutive year TE has been recognized for its achievements in innovation, and marks the first year Clarivate Analytics released this list under its new brand identity, following the sale of the Intellectual Property & Science business of Thomson Reuters to Onex Corporation and Baring Private Equity Asia in October 2016.
The 2016 Top 100 Global Innovators report honors the most innovative corporations and institutions in the world as determined by analyzing proprietary data including patent volume, patent-grant success rates, global reach and invention influence. The 2016 report reveals that on average, the 2016 Top 100 Global Innovators invest 9.1 percent more in R&D than those in the S&P 100.[Continue reading →]
CMB-B72 fanless barebone system Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Industrial Single Board Computers, launches CMB-B72 PICMG 1.3 half-size series fanless barebone system based on Intel® 6th generation "Skylake-H" Core™ i7/i5/i3 processor with three expansion slots, is designed to meet the expansion capability(provides three expansion slots with two different combinations of PCI and PCIe slots: a. two PCI and one PCIe x16; b. one PCI, one PCIe x1 and one PCIe x16.), high performance, high-end media, broad I/O and fanless for a flexibility and wide variety of transportation, military, industrial, medical and telecommunication applications and more.
The CMB-B72 barebone system is designed for the 6th generation Intel® Core™ H-series processors in the FCBGA1440( will be comprised of Core™ i3-6100E 2.7GHz with 2 CPU cores, or i5-6440EQ Tubbo Boost up to 3.4GHz with 4 CPU cores, or i7-6820EQ Tubbo Boost up to 3.5GHz with 4 CPU cores) and accompany with Intel® QM170 Chipset. DDR4 memory is supported up to a total of 32GB( 2 DDR4 SO-DIMM 2133 MHz), The barebone is based on Intel® HD530 Graphics that provides high-end media and graphics capabilities for devices that display videos, 2D/3D graphics and interactive content. In addition, The CMB-B72 supports up to three independent displays port with 4K resolution ( 1 x DisplayPort, 1 x DVI-D, 1 x VGA) to provide its advanced solutions for imaging, machine vision and infotainment applications. [Continue reading →]
CHELMSFORD, Mass. - Jan. 11, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it recently received $6.9 million in orders relating to a sensor processing application for fighter aircraft. The orders were booked in the Company’s fiscal 2017 second quarter.
“Mercury’s outstanding working relationship with this customer, forged through years of close collaboration, continues to help drive the success of this critical airborne program,” said Didier Thibaud, Mercury’s Executive Vice President and Chief Operating Officer. “This collaboration will enable our customer to continue to leverage Mercury's commercially developed modular open architecture-based signal processing technology to realize faster time to market and a lower total cost of ownership for their program.”[Continue reading →]
Electric Imp's new IoT QuickStart Family is designed to help customers cut the time to build, test and prototype complex IoT solutions while maintaining industrial-strength security, scalability and control. Based on reference designs that Electric Imp experts have developed over the past five years, the IoT QuickStart Family appliances represent the most frequently requested secure connectivity and device prototype solutions, each delivered in a fraction of the time and cost required by custom-built solutions.[Continue reading →]
Las Vegas, International CES 2017, LVCC North Hall, Booth 7029 – BlackBerry Limited (NASDAQ: BBRY; TSX: BB) has announced its most advanced and secure embedded operating system (OS) for the automotive industry. QNX® Software Development Platform 7.0 (QNX® SDP 7.0) is a 64-bit OS that builds on the proven reliability of QNX technology and raises the bar for security and performance in cars. At CES 2017, the technological capabilities of QNX SDP 7.0 will be demonstrated in BlackBerry QNX’s 2016 Jaguar XJ and 2017 Lincoln MKZ concept cars.
“With the push toward connected and autonomous vehicles, the electronic architecture of cars is evolving - from a multitude of smaller processors each executing a dedicated function, to a set of high performance domain controllers, powered by 64-bit processors and graphical processing units,” said John Wall, senior vice president and head of BlackBerry QNX. “To develop these new systems, our automotive customers will need a safe and secure 64-bit OS that can run highly complex software, including neural networks and artificial intelligence algorithms. QNX SDP 7.0 is suited not only for cars, but also for almost any safety- or mission-critical application that requires 64-bit performance and advanced security. This includes surgical robots, industrial controllers and high-speed trains.”[Continue reading →]
New, dual threaded 64-bit Altivec(tm)-enabled VPX6-197 SBC features a quad-core T2080 processor, delivers 1.8 GHz non-throttling processing performance with only 42 watts of power dissipation[Continue reading →]
CHELMSFORD, Mass. - Jan. 5, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $24.4 million follow-on order from a leading defense prime contractor for integrated radio frequency (RF) and digital subsystems for an electronic warfare (EW) application. The order, which includes an option to purchase additional units, was booked in the Company’s fiscal 2017 second quarter and is expected to be shipped over the next several quarters.
“This follow-on order confirms Mercury’s leadership position in EW and further validates our strategy of converging RF and digital technologies to meet the increasing demands in today’s electromagnetic threat environment,” said Charlie Hudnall, Vice President and General Manager of Mercury’s Embedded Sensor Products group. “We’re honored to supply high-speed, broadband electronics that expand our military forces’ strategic advantage over our adversaries.”[Continue reading →]
CHANDLER, Ariz., Dec. 12, 2016 — The new PIC24 “GA7” family of microcontrollers (MCU) is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. As the lowest-cost 256 KB Flash memory 16-bit MCUs available today, these PIC24 devices enable extremely cost-effective designs for Internet of Things (IoT) sensor nodes, portable medical devices and industrial control applications. For more information about Microchip’s PIC24 “GA7” family visit: www.microchip.com/pic24ga705
The PIC24 “GA7” family enables developers to cut power consumption, cost and space. The devices offer low-power modes including multiple sleep modes, down to 190 nA, to greatly decrease power consumption for extended battery life in portable applications at a fraction of the cost of previous solutions. The new devices also offer up to 256 KB Flash and 16 KB RAM and are available in 28, 44 and 48 pin count package options, some as small as 4 x 4mm.[Continue reading →]
RFEL has been awarded a further phase of the Osborne programme for Defence Science and Technology Laboratory (DSTL), Porton Down, UK. The Osborne programme provides DSTL with the capability to conduct Electronic Warfare (EW) Systems development using Model-Based Design.[Continue reading →]
Leti experts will give four presentations at SEMICON Europa, Oct. 25-27, in Grenoble, and Leti's Patterning Program Manager Laurent Pain will chair a session on lithography. Leti also will present multiple product demos in a wide range of fields that showcase how its advanced technology has gone from research to final product.[Continue reading →]
As learning algorithms break free from the confines of the computer rooms of research institutes and into the real world, the evolution of these algorithms is expected to progress rapidly, allowing classifiers to distinguish between an ambulance and a delivery truck, or a school bus and a van, for example.[Continue reading →]
PHOENIX, Ariz. – Sept. 27, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has announced three new devices for driving 3- phase BLDC motors via 180 degree sinusoidal waveforms. Designed for use in cooling fans of household appliances such as refrigerators, as well as games consoles and computing equipment, the LV8811, LV8813, and LV8814 have voltage ranges of 3.6 volts (V) to 16 V, 6 to 16 V, and 3.6 to 16 V respectively. These highly integrated, software-less motor drivers simplify motor control circuit design by eliminating software development time. In addition, these devices reduce acoustic noise and vibration, and enable deployment of energy efficient motor controls. They can be controlled by a single Hall sensor, reducing system costs. Motor speed can be set by either a pulse width modulated (PWM) signal or a DC voltage. Furthermore, their lead angle can easily be adjusted.
The LV8811, the LV8813, and the LV8814 incorporate over-current, over-voltage, under-voltage, and over-temperature protection functions. Also included are locked rotor protection and auto-recovery mechanisms. Soft start-up and shutdown functionality ensures that ongoing operational stability is maintained. [Continue reading →]
Linaro Ltd, the collaborative engineering organization developing open source software for the ARM® architecture, today announced the launch of the Linaro IoT and Embedded (LITE) Segment Group. Working in collaboration with industry leaders, LITE will focus on delivering end to end open source reference software for more secure connected products, ranging from sensors and connected controllers to smart devices and gateways, for the industrial and consumer markets.
Industry interoperability of diverse, connected and secure IoT devices is a critical need to deliver on the promise of the IoT market. Today, product vendors are faced with a proliferation of choices for IoT device operating systems, security infrastructure, identification, communication, device management and cloud interfaces. Vendors in every part of the ecosystem are offering multiple choices and promoting competing standards. Linaro and the LITE members will work to reduce fragmentation in operating systems, middleware and cloud connectivity solutions, and will deliver open source device reference platforms to enable faster time to market, improved security and lower maintenance costs for connected products.[Continue reading →]
The Latest in large format Military Grade 3D Printers
Need a heavy duty large format 3D printer that can handle rough environments and produce large scale topographical and building structural displays from a 3D LIDAR data point cloud? That’s what the US Marines needed. They found the answer in the Amphibious Assault Planning System, a turnkey solution using a Syncromaxx High Speed Large Format Military Grade PLA 3D printer (www.syncronetics.com) with integrating software to import and convert large point cloud data collected by TopCon GLS 2000 Laser Scanners. The large format 42” x 42” x 30” print volume can accommodate a wide range of topographical and photogrammetric printing requirements, including aerial and sub-surface surveys. Other applications include: architectural work, asset surveying, rapid prototyping, and reverse engineering of forming tools or automotive or construction components such as large castings.[Continue reading →]
Cambridge Pixel's free SPx Radar Coverage Tool assists commercial security/defence integrators, installers and developers to select the optimum location for a radar or other sensor based on line-of-sight visibility.[Continue reading →]
SAN FRANCISCO, Sept. 19, 2016 -- JavaOne 2016, Booth #5212 – FreeWave Technologies, Inc. (www.freewave.com), a leader in industrial, secure Machine to Machine (M2M) and Internet of Things (IoT) wireless networking solutions, today announced it has formed a partnership with Resilio, a provider of enterprise and industrial data transfer, BitTorrent-based technology (https://resilio.com/). The partnership will allow users to transfer large amounts of data from multiple nodes, with accelerated upload speeds and increased reliability by de-centralizing the data transfer process.
Earlier this year, FreeWave launched its new ZumLink radio series (go.freewave.com/zumlink), a flexible radio platform designed to support high data throughput speeds and third-party applications to enable a programmable edge network. Resilio Connect's highly scalable, highly dependable software utilizes BitTorrent technology as underlying protocol to transfer data in a third-party application on the ZumLink platform.[Continue reading →]
4DSP expands their high performance FMC board portfolio with the addition of the FMC121 and FMC123. Both cards are ideal for high channel count, high speed applications such as beamforming radar or MIMO SDR systems.[Continue reading →]
Photodiode SFH 2440 L from Osram Opto Semiconductors enables fitness sensors to be made extremely thin. To save on mounting height it can be flush mounted in the board. Its spectral sensitivity – high in the green range and extremely low in the infrared range – has been designed specifically for heart rate measurements. Picture: Osram Photodiode SFH 2440 L from Osram Opto Semiconductors saves on mounting height in the design of heart rate sensors. It can be flush-mounted on the printed circuit board (PCB), with longer leads ensuring secure mounting and reliable solder points. The component also features spectral sensitivity specially designed for measuring heart rate.
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HARRISBURG, Pa. – September 13, 2016 –TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, offers its Raychem Cat 6a cable to help meet the demands of harsh environment military and aerospace applications. The ruggedized cable design delivers 10Gb/s of high speed data transmission which meets or exceeds cat6a electrical requirements with sufficient margin.
TE’s Raychem Cat 6a cable is designed for a variety commercial and military applications, including in-flight entertainment systems, flight control, avionics, cabin management systems and military ground vehicles. It’s constructed with engineered fluoropolymers able to support ANSI/TIA-568-C specifications for stable performance in extreme conditions over long lengths. TE’s manufacturing process and engineered fluropolymer materials enable this cable to be made in 26 AWG aimed to save size and weight. [Continue reading →]
Ridgetop Group, Inc. and Silicon Valley-based BaySand Inc., the leader in application configurable application specific integrated circuits (ASICs), today announced they will work cooperatively to develop a series of new applications to increase their existing mixed-signal intellectual property (IP) portfolios.
Through a wide-ranging partnership, they also will offer system-on-chip (SoC) developers in Silicon Valley and Asia design expertise and field programmable gate array (FPGA)-to-ASIC conversion for mass production using Ridgetop Group technology.[Continue reading →]
An international project to develop technology and architectures for mimicking neural behavior in integrated circuits will review the state of the art in creating neuromorphic circuits and bring together the device and design communities for this promising field on Sept. 12 in Lausanne, Switzerland.[Continue reading →]
Weybridge, UK, 1 September 2016 - TT Electronics, a global provider of engineered electronics for performance critical applications, today announced the market introduction of its versatile TPM Series of high-performance industrial pressure transmitters. Featuring digital compensation to provide accurate, reliable pressure measurements with excellent long-term stability over a temperature range from -20° to +125 °C, the TPM Series is ideal for applications in hydraulic and pneumatic systems, and for fuel and lubricant pressure sensing, leak detection, filter testing and tank level sensing. These demanding requirements can be found in many different industries from chemical plants, mining and power generation to plastics manufacturing, water treatment plants and farming.
TPM Series transmitters deliver a 4-20mA output that is proportional to the pressure directly detected by a four-arm, active strain-gauge bridge that is formed from highly stable resistors fused to a high purity ceramic pressure-sensing element. Internally, the electronic elements comprise a primary signal processing module that utilises an ASIC-based high speed digital signal processor and a separate board that handles the interface and EMC immunity and emissions requirements. During manufacture the sensor can be individually addressed or treated as part of a batch depending on customer performance and calibration requirements. All elements of the TPM combine to ensure a ±0.1% span non-linearity, hysteresis and repeatability specification (BFSL) over the full operating temperature range together with excellent long-term stability (±0.1% span / 12 months typical).[Continue reading →]
ams acquires MAZeT Dr. Fred Grunert is CEO of MAZeT GmbH Strategic transaction will drive color and spectral sensing growth opportunities in industrial, automotive and medical applications.
ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, has closed the transaction to acquire 100% of the shares in the color and spectral sensing systems specialist MAZeT GmbH for an undisclosed amount in cash. The strategic acquisition extends ams’ market leadership in advanced optical sensors and strengthens ams’ position in emerging optical sensing applications.[Continue reading →]
Los Angeles, CA – July 26, 2016 — myDevices, creators of Cayenne, the world’s first drag-and-drop IoT project builder, and Senet, the first and only North American provider of public, low-power, wide-area networks (LPWANs) for long range-based (LoRa®-based) Internet of Things (IoT) applications, today announced their IoT technology partnership.
The collaboration between the two companies will provide an integration of Senet’s open, standards-based network with myDevices’ connected device solution to simplify the creation and deployment of IoT projects utilizing the LoRa® ecosystem. [Continue reading →]
The Measuring Division of Kaman Precision Products, Inc., a world leader in the design and manufacture of high-performance, precision non-contact position measuring systems, announces the availability of its KD-2306 single-channel multi-purpose non-contact displacement sensing system.[Continue reading →]
The counter-UAV AUDS team, consisting of Blighter Surveillance Systems, Chess Dynamics, Enterprise Control Systems and Liteye Systems, Inc., will showcase its Anti-UAV Defence System (AUDS) at this year's Farnborough International Airshow.[Continue reading →]
A smart grid sensor is a small and lightweight node that serves as a detection station in a sensor network. Smart grid sensors enable the remote monitoring of equipment such as transformers and power lines, and the demand-side management of resources on an energy smart grid. Smart grid sensors are generally used to monitor weather conditions and power line temperature, which can then be used to calculate the line’s carrying capacity. This process, known as dynamic line rating, helps in increasing the power flow of existing transmission lines for power companies. A smart grid sensor can also be used within homes and businesses to increase energy efficiency. A smart grid sensor can be of four types: microcomputer, transducer, power source, and transceiver .
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Military systems are noted for their high processing demands, a situation that is particularly true for graphics processing. Like their commercial counterparts, military displays are becoming faster, higher-resolution, and more complex. Both defense surveillance and commercial video-game applications, for example, share a need for the maximum possible raw graphics computational horsepower.[Continue reading →]
BIRD Aerosystems company will showcase a new generation of the Directional Infra-Red Counter Measure (DIRCM) system called Self Protection Radar Electro-Optic System (SPREOS) in the upcoming Eurosatory 2016.[Continue reading →]
Telit, today announced it has collaborated with USRobotics®, a division of UNICOM® Global, on integrating its deviceWISE Asset Gateway software on the USR3510 Courier® M2M 3G Cellular Gateway. The USR3510 has been added to the deviceWISE Ready program as a certified gateway – assuring quick and seamless onboarding to the Telit IoT Portal, powered by deviceWISE, for the development of end-to-end M2M/IoT solutions across different markets and industries.
The cost-effective Courier® M2M 3G Cellular Gateway with embedded Ethernet, Serial, and GPS is certified for all major GSM/HSPA+ and CDMA/EVDO 3G cellular networks for LAN to WWAN routing. The embedded serial port allows quick implementation for a wide variety of serial based systems already out in the field making it ideal for M2M Serial applications including remote maintenance and control, Point of Sale, monitoring, and automation. The cloud based GUI allows fast and easy carrier changes, loading of custom configurations, and remote device management. Advanced features include persistent connectivity, an automatic provisioning system, and an open architecture for easy customization.[Continue reading →]