EnSilica has announced two senior-level appointments designed to significantly boost its rapidly expanding full System-on-Chip (SoC) services as the company continues to expand its base of customers seeking complex, full-service custom analog and mixed-signal chip design and supply. EnSilica has appointed David Tester to the newly created position of Director of SoC Architecture and Patrick McNamee to the newly created position of Director of Silicon Operations.[Continue reading →]
Utilizing EnSilica’s eSi-RISC processor, Solomon Systech’s SSD2098 Touch and Display Driver Integration (TDDI) IC targets FHD In-Cell LTPS panels for smartphones Wokingham, UK – August 10, 2017. EnSilica, a leading independent provider of semiconductor solutions and IP, and Solomon Systech, a leading provider of touch and display ICs and system solutions, have entered into a multi-year licensing agreement for EnSilica’s range of highly-configurable, high-performance, and low-power eSi-RISC processor IP. The multi-year licensing agreement covers the full range of EnSilica’s 16 bit and 32 bit eSi-RISC processor IP and extends the existing, successful relationship between the two companies to cover multiple projects and multiple architecture implementations.
EnSilica’s eSi-RISC processor IP has been adopted by Solomon Systech to power several of its smart touch screen controllers and drivers. Headquartered in Hong Kong with additional technology centers throughout Asia (China, Japan, Korea and Taiwan) and in Europe (United Kingdom), Solomon Systech operates on a fabless business model. The company specializes in the design, development and sales of proprietary IC products that enable a wide range of display applications for smartphones, tablets, smart TVs/monitors, notebooks and other smart devices, including wearables, healthcare devices, connected home devices, as well as industrial appliances, etc. [Continue reading →]
The integration with Azure IoT Hub enables Electric Imp's customers to use Microsoft's storage and advanced data analytics, while simplifying the setup and management of highly scalable, secure communications between the edge and cloud.[Continue reading →]
SAN JOSE, Calif. -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced it has collaborated with the Embedded Real-Time System Laboratory of Nagoya University to port the AUTOSAR-compliant TOPPERS ATK2-SC1 (Toyohashi OPen Platform for Embedded Real-time Systems Automotive Kernel version-2 Scalability Class 1) to Cadence® Tensilica® processors and DSPs. Nagoya University and Cadence jointly ported the ATK2-SC1 to the Tensilica processor platform, validating that it functions correctly and operates at competitive performance levels. With this port, developers working on advanced driver assistance system (ADAS), human machine interface (HMI), autonomous driving system and other automotive applications requiring the high computational capabilities of Tensilica processors can start early development of automotive applications on the TOPPERS automotive kernel. For more information about ATK2-SC1, visit https://www.toppers.jp/atk2.html.
Automotive electronic systems are increasing exponentially in complexity, making it increasingly challenging for electronic control units (ECUs) to perform their specific control functions while also connecting to the various automotive networks reliably. The AUTOSAR architecture organizes the building blocks that compose the ECU software stack, allowing multiple suppliers and OEMs to collaborate on the development of critical system components. Reuse of well-defined software components allows ECUs to be developed quickly and efficiently, and systems are becoming more heterogeneous in their deployment of processors and DSPs.[Continue reading →]
ANDOVER, Mass. – July 31, 2017 – Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $5M order from a leading defense prime contractor for airborne tactical mission computers in a maritime patrol aircraft. This is a follow-on to previous orders for systems destined to different countries. The order was booked in the Company’s fiscal 2017 fourth quarter.
The mission computers will perform a variety of functions ranging from video capture and graphical display to Ethernet switching. Based on open systems architecture and standard interfaces using 6U OpenVPX modules and Intel CPUs, the computer systems provide the flexibility to integrate the different sensors needed for variations in platform by end user countries.[Continue reading →]
PARIS, France — July 27, 2017 — VITEC, a worldwide leader in advanced video encoding and streaming solutions, today announced it will demonstrate its broad range of point-to-point streaming and full motion video (FMV) solutions engineered for mission-critical and tactical military and defense operations at stand N7-350 at DSEI. Held Sept. 12-15 at ExCeL in London, DSEI is the world’s largest fully integrated international defense exhibition featuring land, sea, and air products and technologies.
“The video and metadata requirements of modern military and defense applications continue to evolve, making live, real-time video delivery and management in the tactical arena a true challenge,” said Mark Rushton, business development manager at VITEC. “VITEC’s latest encoding solutions and IPTV management system are designed to allow military personnel to easily disseminate live feeds and recorded video assets in various bit-rates optimized for the specific network link available, whether stationary or in the field.”[Continue reading →]
VP62105 July 28th, 2017, as an independent embedded computer manufacturer, LinkedHope® released a 6U VPX single board VP62105. Based on the Intel® 3rd generation CoreTM i3/i5/i7 platform, VP62105 has a new microarchitecture that enables small-sized designs to be created with unmatched computing power, graphics performance and energy efficiency on a small footprint.
VP62105 provides 4 Serial RapidIO (SRIO) x4 links for VPX Data Plane communication, 2 PCI express x8 channel for VPX Expansion Plane communication and 4 Gigabit Ethernet for VPX Control Plane communication. The rich data interchange options make it much easier to build computer and system solutions.[Continue reading →]
AVerMedia's latest industrial HDMI 1.4a video capture card targeted at embedded solutions for machine vision, medical imaging, or in-vehicle solutions, both civilian and military and it now comes with a preview version of the Pro SDK.[Continue reading →]
VP68801 July 27th, 2016, as an independent embedded computer manufacturer, LinkedHope® announces its new 6U VPX L3 Ethernet and SRIO Switch board, named VP68801, a China Local-design, Local-manufacturing product.
VP68801 is a China local design VPX Switch, compliant with VITA46.0, VITA48, and VITA65 specifications. The Profile of VP68801 is SLT6-SWH-16U20F-10.4.2, which uses Gb Ethernet as control plane and SRIO as data plane. It is mainly applicable to high-speed data exchange and routing among different types of payload boards in a VPX chassis. The switching board is designed as 6U VPX form factor, supporting both traditional air-cooled version and conduction-cooled version. With reliable anti-shock and vibration capability, excellent heat dissipation performance and unique environment protection design, the whole board can be stably operated in the wide temperature environment of -40°C to +85°C.[Continue reading →]
ANDOVER, Mass. - July 26, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced it received a $5.5M follow-on order from a leading defense prime contractor for compact, highly ruggedized, system-in-package (SiP) devices for an airborne weapons application. The order was booked in the Company’s fiscal 2017 fourth quarter and is expected to be shipped over the next several quarters.
“Mercury’s unique three-dimensional packaging technology embeds both memory and a microprocessor in a single, military-hardened form factor ideal for the harsh operating environments typical of weapon applications,” said Charlie Leader, Senior Vice President and General Manager of Mercury’s Advanced Microelectronics Solutions group. “Our valued customers and our nation’s warfighters can depend on Mercury to provide long-term, trusted supply chain continuity for military programs that matter to our national defense interests.”[Continue reading →]
Themis Computer, a manufacturer of rugged computing platforms, today announced the launch of its next generation XR6 Rugged Enterprise Servers (RES) featuring the newest Intel Xeon Scalable (Skylake) Processors.[Continue reading →]
Today, Tech Data announced that NEXIONA's innovative range of IoT software is now available on the Tech Data Cloud Solutions Store, powered by StreamOne, Tech Data's platform for end-to-end provisioning and billing of software and cloud services.[Continue reading →]
Nuvo-6108GC Neousys Technology today launched Nuvo-6108GC, the world’s first industrial-grade GPU computer integrating NVIDIA® GeForce® GTX 1080 or TITAN X and an Intel® Xeon® processor.
Powered by Intel® Xeon® E3 v5 or 6th Gen Core™ processor with C236 chipset, Nuvo-6108GC supports up to 32GB ECC/ non-ECC DDR4 memory and has rich I/O ports such as Gigabit Ethernet, USB3.0, video ports and serial ports. In addition to the x16 PCIe port for GPU installation, there are two x8 PCIe expansion slots for additional devices or for other application means.[Continue reading →]
Middletown, CT – The Measuring Division of Kaman Precision Products, Inc., a world leader in the design and manufacture of high-performance, precision non-contact position measuring systems, announces the availability of its KD-5100 differential measurement system, which provides resolution to a nanometer of positional change. With its proven stable design, extremely small size, and low power consumption, the KD-5100 is ideal for night vision systems, precision telescope positioning, fast steering mirrors (FSM) for space-based and airborne applications, and image stabilization systems. Kaman engineers work closely with customers to understand their specific application and optimize the KD-5100 to meet custom requirements.
Featuring a small package size – only 2 x 2.12 x 0.75 inches thick – the KD-5100 is a good choice for applications where space is a limiting factor. It is manufactured to MIL-H-38534, with MIL-SPEC components used throughout the electronics module wherever possible. The KD-5100 features rugged construction, with a mean time between failures of better than 238,000 hours in a space flight environment and 55,000 hours in a tactical environment. Kaman also offers the DIT-5200, a commercial version of the KD-5100 for applications where mil-spec requirements, size, weight and power consumption are not critical.[Continue reading →]
Middletown, CT – The Measuring Division of Kaman Precision Products, Inc., a world leader in the design and manufacture of high-performance, precision non-contact position measuring systems, announces the digiVIT digital variable impedance transducer. With its user-friendly new graphical user interface (GUI) for easier setup and connectivity, and cloud-based data access/monitoring, the digiVIT offers a wide array of networking capabilities ideal for Industrial Internet of Things (IIoT) applications. It is a good choice for position, vibration, and proximity sensing, part sorting, process control, laboratory testing, engine dynamics testing, condition monitoring, and more.
The digiVIT is the most advanced digital signal conditioner for noncontact linear position and displacement sensing available on the market. It is a self-configuring system, which is capable of performing with nearly any sensor, from any manufacturer, as well as any conductive target. The transducer also features simple pushbutton calibration, temperature compensation, and zeroing. [Continue reading →]
ANDOVER, Mass. - July 24, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced it received an $8.5M follow-on order from a leading defense prime contractor for high density secure memory devices for integration into the computing systems of an advanced military avionics program. The order was booked in the Company’s fiscal 2017 fourth quarter and is expected to be shipped over the next several quarters.
“This order further reinforces Mercury’s dominant position in the design and manufacturing of secure and trusted memory devices for today’s most SWaP-sensitive military programs,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our Advanced Microelectronics Centers are privileged to provide long-term supply continuity for affordable, ruggedized and highly miniaturized memory devices demanded by our military forces around the globe.”[Continue reading →]
XM61001 July 24th, 2017, as an independent embedded computer manufacturer, LinkedHope® released a China local-designed, local-manufactured XMC processor board XM61001, which is a XMC graphics & image processing board mainly used for high-performance embedded graphics & image processing and GPU general-purpose computing (GPGPU) applications. Based on AMD Radeon™ E8860 embedded GPU, XM61001 provides 768/48 GFLOPS single/double precision peak (600e/4.5Gbps) processing performance, 640 independent computing units (shaders) as well as a maximum power consumption of 37W and a minimal power consumption of about 15W when adjusted to low power mode. It is especially suitable for high definition (1920*1080) and 4K (3840*2160) UHD displays, high-performance parallel computing and other GPGPU applications.
XM61001 has a 128-bit GDDR5 independent video memory up to 2GB, and the whole board is reinforced to meet the anti-shock and anti-vibration requirement described in VITA 42 and VITA 48 specifications. XM61001 also supports OpenGL 4.2, DirectX 11.1 APIs and industry-standard OpenCL™ 1.2 program language.[Continue reading →]
The brand new FreeRTOS programmable remote I/O module, RIO-2014PG. Example programs demonstrate serial and Ethernet data communication, as well as how to push sensor data to IBM Bluemix using MQTT for quick sensor to cloud application development. Low power consumption of ARM cortex M4 plus high efficiency of FreeRTOS make RIO-2014PG an ideal light weight computing platform for device networking and remote monitoring.[Continue reading →]
New family of pre-integrated systems speeds the development, and reduces the design risk for deployed application-specific solutions. ASHBURN, Va. – July 6, 2017 – Curtiss-Wright’s Defense Solutions division today introduced a new family of pre-integrated rugged mission management systems designed to lower the cost, speed the development, and reduce the design risk for deployed application-specific solutions. Through the use of fully integrated and tested industry-leading COTS modules, these base systems are architected, pre-qualified and pre-verified to address the needs of specific mission requirements. By providing a proven pre-configured base solution, these systems deliver a significant “headstart” that significantly reduces the integrator’s development cycle and costs. Using one of Curtiss-Wright’s pre-integrated hardware solution sets as their starting point, a system integrator can easily and quickly customize the base system by with application-specific software and/or expanding the base system with additional components to meet their application’s unique requirements. The first member of this innovative new family of pre-integrated solutions is designed for Software Defined Radio (SDR) and Electronic Warfare (EW) applications. It will be followed by announcements for additional application-specific pre-integrated base systems designed for applications such as Radar, EO/IR, and Video/Display.
“More and more frequently, our customers are asking us to help them jumpstart their application specific system designs with cost-effective pre-integrated system architectures that quickly get them most of the way to completion of their development by using proven COTS elements,” said Lynn Bamford, senior vice president and general manager, Curtiss-Wright Defense Solutions division. “Our new family of application-specific mission management systems hits the sweet spot for these designers, with ‘pre-rolled’ systems targeted for applications such as Software Defined Radio and Electronic Warfare. These high-TRL systems provide our customers with an easy to customize base system that delivers a head-start for faster deployment while lowering risk to program schedule and budget.”[Continue reading →]
According to the report, global IoT sensors market was valued at around USD 7.51 billion in 2016 and is expected to reach approximately USD 27.38 billion in 2022, growing at a CAGR of slightly above 24% between 2017 and 2022.[Continue reading →]
Acquisition uniquely positions Mercury as a leading commercial provider of secure and safety-critical processing subsystems for aerospace and defense applications, facilitating continued growth.[Continue reading →]
ANDOVER, Mass. - June 29, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced that its West Lafayette, Ind. facility received the 2017 James S. Cogswell Outstanding Security Achievement Award from the U.S. Department of Defense’s Defense Security Service (DSS). Mercury’s Hudson, N.H. Advanced Microelectronics Center previously received a Cogswell Award.
This award, which recognizes industrial security excellence, is the highest honor the DSS presents to cleared industry partners. Out of the approximately 13,500 cleared facilities nationwide, only 36 facilities received a Cogswell Award this year. Facilities may be nominated for the award only if they have a minimum of two consecutive superior industrial security review ratings and show a sustained degree of excellence and innovation in their overall security program management, implementation and oversight. [Continue reading →]
ANDOVER, Mass. - June 28, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced it received an $8.0M follow-on order from a leading defense prime contractor for state-of-the-art GPS Selective Availability Anti-Spoofing Modules (SAASM) for a precision guided munitions program. The order was booked in the Company’s fiscal 2017 fourth quarter and is expected to be shipped over the next several quarters.
“Receiving this follow-on order exemplifies how Mercury’s next generation business model continues to deliver affordable, highly differentiated microelectronic solutions to defense prime contractors,” said Charlie Leader, Senior Vice President and General Manager of Mercury’s Advanced Microelectronics Solutions group. “We are honored to continue supplying our customers and our military forces with sensor processing chain solutions manufactured in our secure and trusted Advanced Microelectronics Centers located throughout the United States.”[Continue reading →]
Compact Imaging, Inc. (CI) today announced that SRI International has selected CI's non-invasive depth scanning sensor, MRO(tm), as a critical component in the development of "dynamic biometrics" for improved detection of attempts to evade or deceive biometric security systems, such as fingerprint scanners. The development is being performed under a multi-year contract awarded to SRI as part of IARPA's (Intelligence Advanced Research Projects Activity, National Intelligence Directorate) Odin Program.[Continue reading →]
The new Inelta ILAT miniature LVDT sensors provide highly accurate position/path measurements for a applications with very tight space tolerances. This includes Medical Technology, Engineering, Agriculture and Navigation as well as Testing Facilities and Manufacture of special purpose machinery.[Continue reading →]
Leti, a research institute of CEA Tech, today announced that Leti's embedded sensor fusion solution, SigmaFusion, has been embedded in Infineon Technologies' AURIXTM TC29x platform. This platform enables automotive developers to control powertrain, body, safety and ADAS applications with one single microcontroller family.[Continue reading →]
W. L. Gore & Associates, Inc. (Gore) announced today that GORE-FLIGHT(tm) Microwave Assemblies and GORE(r) Microwave/RF Assemblies for military aerospace applications have successfully passed stringent U.S. Army flight qualifications on the MH-47 Rotorcraft[Continue reading →]
Mercury Systems Unveils First 3U Transceiver ANDOVER, Mass. - April 26, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com) announced the Ensemble® DCM-KU-4R2G-2T3G ultra-low-latency transceiver developed to meet the demanding requirements of advanced electronic warfare (EW) applications and to provide high-speed signal processing capability suited to ultra-wideband communications and synthetic aperture radar (SAR) applications. Designed in accordance with OpenVPX™ standards at Mercury’s Huntsville, Ala. facility, the new transceiver is optimized for low probability of interception (LPOI) radio frequency (RF) signal detection in heavily contested electromagnetic environments. Ideal for digital radio frequency memory (DRFM) applications, Mercury’s new product seamlessly couples coherent multi-channel, multi-board functionality with best-of-breed spectral purity in a 3U form factor ruggedized for harsh military environments.
Modern military forces rely increasingly on electronic warfare technologies to secure a competitive advantage prior to physical engagement with an adversary. At the same time, commercial applications, such as wireless data and voice transmission signals, crowd the spectrum, virtually masking electromagnetic signals of military interest. Maintaining a dominant position on the electromagnetic battlefield necessitates simultaneous discernment of small signals over a wide bandwidth of frequencies with exceptional precision. Swift identification of these signals is critical to generate an appropriate and timely response to recognized threats. Mercury’s newest innovation addresses this signal detection challenge by densely integrating state-of-the-art RF and digital technologies to maximize spectral efficiency while simultaneously reducing physical size and weight. [Continue reading →]
A new demonstrator combines two cutting-edge technologies that include the RH850/V1R-M microcontroller (MCU) from the Renesas autonomy Platform and ADI's Drive360 advanced 28nm CMOS RF-to-bits technology.[Continue reading →]
NEWTON, Mass., April 25, 2017 (GLOBE NEWSWIRE) -- Sensors Expo & Conference (#Sensors17) the nation's leading event focusing exclusively on sensors and sensor-integrated systems, today announced details of a new Automotive & Autonomous Vehicle Sensors Workshop to take place on Wednesday, June 28. Spearheaded by Willard Tu, Executive Vice President, DSP Concepts, Inc., the half-day workshop will feature a series of panel discussions focusing on sensors and their role in automotive and autonomous vehicles. In addition, the Autotech Council will host a “Startup Review” to highlight new and exciting startups in the automotive sensing industry on Wednesday, June 28.
Quick Links: [Continue reading →]
The embedded box PC TANK-870-Q170 from ICP Deutschland is especially made for the usage in image processing applications. It combines an optional POE expansion, RAID function and different PCI, PCIe and PCIe MIni Card expansion possibilities.[Continue reading →]
Fujitsu Components America, Inc. and enmo Technologies, a leader in mobile IoT, today announced a technology collaboration to support Fujitsu IoT devices in the enmo Platform. The first result of this collaboration is that the Fujitsu Sensor Beacon IoT device now is supported in the enmo Platform.
“We worked very closely with enmo to port their IoT.Over.BeaconTM technology to our Sensor Beacon IoT device,” said Bob Thornton, president/COO of Fujitsu Components America. “Complete Smartphone Apps for IoT deployments that use our Sensor Beacon now can be developed and launched in minutes through the enmo Platform. We look forward to continuing to work with enmo to have their Platform support other Fujitsu IoT devices, such as our Blue Brain module.”[Continue reading →]
Mercury Systems Defense DDR4 High Density Secure Memory Device CHELMSFORD, Mass. - March 2, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced the latest development in its high density secure memory product line, integrating double data rate fourth-generation synchronous dynamic random-access memory (DDR4 SDRAM) with its SWaP-efficient packaging technology. Replacing up to eighteen industrial or commercial DDR4 devices with a single military-hardened component, Mercury delivers space savings up to 75% in a ball grid array (BGA) package with data transfer speeds up to 3200 Mb/s. Mercury’s Advanced Microelectronics Center (AMC) in Phoenix, Ariz., will produce 8GB DDR4 devices in the second half of 2017 to support next-generation customer designs. 2GB and 16GB devices are slated for production thereafter.
“Since pioneering the first DDR high density secure memory devices more than 15 years ago, our miniaturization technology has advanced with each successive generation of DDR memory,” said Iain Mackie, Vice President and General Manager of Mercury’s Microelectronics Secure Solutions group. “Our memory solutions are optimized for density while withstanding the harshest operating environments. With today’s announcement, Defense prime contractors now have a trusted supplier of compact, military-grade DDR4 memory for high-speed, low-power, mission-critical subsystems.”[Continue reading →]
With voice control emerging as a primary interface to consumer electronics, differentiating a single voice from other speakers and background noise is essential to creating a positive user experience. Infineon and XMOS have teamed on a demonstrator design of an enhanced voice controller system. Shown this week at MWC in Barcelona, the demo system combines Infineon's single-chip 60 GHz radar IC and 70db SNR microphones with an XMOS audio processor to handle intelligent beamforming for far field voice capture.[Continue reading →]
HARRISBURG, Pa. – January 12, 2017 – TE Connectivity (TE) (NYSE: TEL), a world leader in connectivity and sensors, has released its DEUTSCH autosport hermetic fuel tank connector range with an aluminum shell. The new connector replaces standard stainless steel materials with aluminum to achieve a 60 percent weight savings.
Designed for the professional motorsport industry, the fuel tank connector goes into the wall of a fuel cell with a glass seal to stop any fuel escaping up the wiring loom.[Continue reading →]
SCHAFFHAUSEN, Switzerland – January 11, 2017 – TE Connectivity Ltd. (NYSE: TEL) (TE), a world leader in connectivity and sensors, was named one of Clarivate Analytics 2016 Top 100 Global Innovators. This marks the sixth consecutive year TE has been recognized for its achievements in innovation, and marks the first year Clarivate Analytics released this list under its new brand identity, following the sale of the Intellectual Property & Science business of Thomson Reuters to Onex Corporation and Baring Private Equity Asia in October 2016.
The 2016 Top 100 Global Innovators report honors the most innovative corporations and institutions in the world as determined by analyzing proprietary data including patent volume, patent-grant success rates, global reach and invention influence. The 2016 report reveals that on average, the 2016 Top 100 Global Innovators invest 9.1 percent more in R&D than those in the S&P 100.[Continue reading →]
CMB-B72 fanless barebone system Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Industrial Single Board Computers, launches CMB-B72 PICMG 1.3 half-size series fanless barebone system based on Intel® 6th generation "Skylake-H" Core™ i7/i5/i3 processor with three expansion slots, is designed to meet the expansion capability(provides three expansion slots with two different combinations of PCI and PCIe slots: a. two PCI and one PCIe x16; b. one PCI, one PCIe x1 and one PCIe x16.), high performance, high-end media, broad I/O and fanless for a flexibility and wide variety of transportation, military, industrial, medical and telecommunication applications and more.
The CMB-B72 barebone system is designed for the 6th generation Intel® Core™ H-series processors in the FCBGA1440( will be comprised of Core™ i3-6100E 2.7GHz with 2 CPU cores, or i5-6440EQ Tubbo Boost up to 3.4GHz with 4 CPU cores, or i7-6820EQ Tubbo Boost up to 3.5GHz with 4 CPU cores) and accompany with Intel® QM170 Chipset. DDR4 memory is supported up to a total of 32GB( 2 DDR4 SO-DIMM 2133 MHz), The barebone is based on Intel® HD530 Graphics that provides high-end media and graphics capabilities for devices that display videos, 2D/3D graphics and interactive content. In addition, The CMB-B72 supports up to three independent displays port with 4K resolution ( 1 x DisplayPort, 1 x DVI-D, 1 x VGA) to provide its advanced solutions for imaging, machine vision and infotainment applications. [Continue reading →]
CHELMSFORD, Mass. - Jan. 11, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it recently received $6.9 million in orders relating to a sensor processing application for fighter aircraft. The orders were booked in the Company’s fiscal 2017 second quarter.
“Mercury’s outstanding working relationship with this customer, forged through years of close collaboration, continues to help drive the success of this critical airborne program,” said Didier Thibaud, Mercury’s Executive Vice President and Chief Operating Officer. “This collaboration will enable our customer to continue to leverage Mercury's commercially developed modular open architecture-based signal processing technology to realize faster time to market and a lower total cost of ownership for their program.”[Continue reading →]
Electric Imp's new IoT QuickStart Family is designed to help customers cut the time to build, test and prototype complex IoT solutions while maintaining industrial-strength security, scalability and control. Based on reference designs that Electric Imp experts have developed over the past five years, the IoT QuickStart Family appliances represent the most frequently requested secure connectivity and device prototype solutions, each delivered in a fraction of the time and cost required by custom-built solutions.[Continue reading →]
Las Vegas, International CES 2017, LVCC North Hall, Booth 7029 – BlackBerry Limited (NASDAQ: BBRY; TSX: BB) has announced its most advanced and secure embedded operating system (OS) for the automotive industry. QNX® Software Development Platform 7.0 (QNX® SDP 7.0) is a 64-bit OS that builds on the proven reliability of QNX technology and raises the bar for security and performance in cars. At CES 2017, the technological capabilities of QNX SDP 7.0 will be demonstrated in BlackBerry QNX’s 2016 Jaguar XJ and 2017 Lincoln MKZ concept cars.
“With the push toward connected and autonomous vehicles, the electronic architecture of cars is evolving - from a multitude of smaller processors each executing a dedicated function, to a set of high performance domain controllers, powered by 64-bit processors and graphical processing units,” said John Wall, senior vice president and head of BlackBerry QNX. “To develop these new systems, our automotive customers will need a safe and secure 64-bit OS that can run highly complex software, including neural networks and artificial intelligence algorithms. QNX SDP 7.0 is suited not only for cars, but also for almost any safety- or mission-critical application that requires 64-bit performance and advanced security. This includes surgical robots, industrial controllers and high-speed trains.”[Continue reading →]
New, dual threaded 64-bit Altivec(tm)-enabled VPX6-197 SBC features a quad-core T2080 processor, delivers 1.8 GHz non-throttling processing performance with only 42 watts of power dissipation[Continue reading →]
CHELMSFORD, Mass. - Jan. 5, 2017 - Mercury Systems, Inc. (NASDAQ: MRCY, www.mrcy.com), announced it received a $24.4 million follow-on order from a leading defense prime contractor for integrated radio frequency (RF) and digital subsystems for an electronic warfare (EW) application. The order, which includes an option to purchase additional units, was booked in the Company’s fiscal 2017 second quarter and is expected to be shipped over the next several quarters.
“This follow-on order confirms Mercury’s leadership position in EW and further validates our strategy of converging RF and digital technologies to meet the increasing demands in today’s electromagnetic threat environment,” said Charlie Hudnall, Vice President and General Manager of Mercury’s Embedded Sensor Products group. “We’re honored to supply high-speed, broadband electronics that expand our military forces’ strategic advantage over our adversaries.”[Continue reading →]
CHANDLER, Ariz., Dec. 12, 2016 — The new PIC24 “GA7” family of microcontrollers (MCU) is now available from Microchip Technology Inc. (NASDAQ: MCHP), a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions. As the lowest-cost 256 KB Flash memory 16-bit MCUs available today, these PIC24 devices enable extremely cost-effective designs for Internet of Things (IoT) sensor nodes, portable medical devices and industrial control applications. For more information about Microchip’s PIC24 “GA7” family visit: www.microchip.com/pic24ga705
The PIC24 “GA7” family enables developers to cut power consumption, cost and space. The devices offer low-power modes including multiple sleep modes, down to 190 nA, to greatly decrease power consumption for extended battery life in portable applications at a fraction of the cost of previous solutions. The new devices also offer up to 256 KB Flash and 16 KB RAM and are available in 28, 44 and 48 pin count package options, some as small as 4 x 4mm.[Continue reading →]
RFEL has been awarded a further phase of the Osborne programme for Defence Science and Technology Laboratory (DSTL), Porton Down, UK. The Osborne programme provides DSTL with the capability to conduct Electronic Warfare (EW) Systems development using Model-Based Design.[Continue reading →]
Leti experts will give four presentations at SEMICON Europa, Oct. 25-27, in Grenoble, and Leti's Patterning Program Manager Laurent Pain will chair a session on lithography. Leti also will present multiple product demos in a wide range of fields that showcase how its advanced technology has gone from research to final product.[Continue reading →]
As learning algorithms break free from the confines of the computer rooms of research institutes and into the real world, the evolution of these algorithms is expected to progress rapidly, allowing classifiers to distinguish between an ambulance and a delivery truck, or a school bus and a van, for example.[Continue reading →]
PHOENIX, Ariz. – Sept. 27, 2016 – ON Semiconductor (Nasdaq: ON), driving energy efficiency innovations, has announced three new devices for driving 3- phase BLDC motors via 180 degree sinusoidal waveforms. Designed for use in cooling fans of household appliances such as refrigerators, as well as games consoles and computing equipment, the LV8811, LV8813, and LV8814 have voltage ranges of 3.6 volts (V) to 16 V, 6 to 16 V, and 3.6 to 16 V respectively. These highly integrated, software-less motor drivers simplify motor control circuit design by eliminating software development time. In addition, these devices reduce acoustic noise and vibration, and enable deployment of energy efficient motor controls. They can be controlled by a single Hall sensor, reducing system costs. Motor speed can be set by either a pulse width modulated (PWM) signal or a DC voltage. Furthermore, their lead angle can easily be adjusted.
The LV8811, the LV8813, and the LV8814 incorporate over-current, over-voltage, under-voltage, and over-temperature protection functions. Also included are locked rotor protection and auto-recovery mechanisms. Soft start-up and shutdown functionality ensures that ongoing operational stability is maintained. [Continue reading →]
Linaro Ltd, the collaborative engineering organization developing open source software for the ARM® architecture, today announced the launch of the Linaro IoT and Embedded (LITE) Segment Group. Working in collaboration with industry leaders, LITE will focus on delivering end to end open source reference software for more secure connected products, ranging from sensors and connected controllers to smart devices and gateways, for the industrial and consumer markets.
Industry interoperability of diverse, connected and secure IoT devices is a critical need to deliver on the promise of the IoT market. Today, product vendors are faced with a proliferation of choices for IoT device operating systems, security infrastructure, identification, communication, device management and cloud interfaces. Vendors in every part of the ecosystem are offering multiple choices and promoting competing standards. Linaro and the LITE members will work to reduce fragmentation in operating systems, middleware and cloud connectivity solutions, and will deliver open source device reference platforms to enable faster time to market, improved security and lower maintenance costs for connected products.[Continue reading →]